A highly integrated transceiver module for 5.8 GHz OFDM communication system using multi-layer packaging technology

A highly integrated transceiver module for 5.8 GHz OFDM communication system is presented. The antenna and filter are directly fabricated on the module using multi-layer packaging technology in order to reduce size and interconnection losses. A cavity backed patch antenna with a vertical feed and an...

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Bibliographische Detailangaben

Hauptverfasser:	Kyutae Lim, Obatoyinbo, A., Sutono, A., Chakraborty, S., Chang-Ho Lee, Gebara, E., Raghavan, A., Laskar, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Ceramics Feeds Filters MMICs OFDM Packaging Patch antennas Radio frequency Transceivers Voltage-controlled oscillators
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