Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics

Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deploy...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Proceedings of the IEEE 2022-01, Vol.110 (1), p.171-192
Hauptverfasser: Song, Chaoyun, Ding, Yuan, Eid, Aline, Hester, Jimmy G. D., He, Xuanke, Bahr, Ryan, Georgiadis, Apostolos, Goussetis, George, Tentzeris, Manos M.
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 192
container_issue 1
container_start_page 171
container_title Proceedings of the IEEE
container_volume 110
creator Song, Chaoyun
Ding, Yuan
Eid, Aline
Hester, Jimmy G. D.
He, Xuanke
Bahr, Ryan
Georgiadis, Apostolos
Goussetis, George
Tentzeris, Manos M.
description Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for \mu \text{W} -level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of "Green IoT" and "Low Carbon" smart home, smart city, smart skin, and machine-to-machine (M2M) applications.
doi_str_mv 10.1109/JPROC.2021.3125285
format Article
fullrecord <record><control><sourceid>proquest_ieee_</sourceid><recordid>TN_cdi_ieee_primary_9614657</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>9614657</ieee_id><sourcerecordid>2617492370</sourcerecordid><originalsourceid>FETCH-LOGICAL-c454t-70380f70e628a3e46be741e8bf40ed8e24a766019b7b72f49539e631ed4712c63</originalsourceid><addsrcrecordid>eNo9kEtLw0AUhQdRsFb_gG4GXKed9yTuamx9UGgpisuQx41MTWfqTKoW_7ypLa4uF853DnwIXVIyoJQkw6f5YpYOGGF0wCmTLJZHqEeljCPGpDpGPUJoHCWMJqfoLIQlIYRLxXvoZ1R95raEgI3Fr8ZDAyE0Wzx3X-Chwrd5-R7KvG3B49StVhtrus84G27wxLsVHtkWrM2HiwlOjS83pvVbfAfBvFncOjz3pgtUeNLAtykawOMGyta7riaco5M6bwJcHG4fvUzGz-lDNJ3dP6ajaVQKKdpIEx6TWhNQLM45CFWAFhTiohYEqhiYyLVShCaFLjSrRSJ5AopTqISmrFS8j673vWvvPjYQ2mzpNt52kxlTVIuE8W6jj9g-VXoXgoc6W3uzyv02oyTbSc7-JGc7ydlBcgdd7SEDAP9AoqhQUvNfEaB5QQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>2617492370</pqid></control><display><type>article</type><title>Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics</title><source>IEEE Electronic Library (IEL)</source><creator>Song, Chaoyun ; Ding, Yuan ; Eid, Aline ; Hester, Jimmy G. D. ; He, Xuanke ; Bahr, Ryan ; Georgiadis, Apostolos ; Goussetis, George ; Tentzeris, Manos M.</creator><creatorcontrib>Song, Chaoyun ; Ding, Yuan ; Eid, Aline ; Hester, Jimmy G. D. ; He, Xuanke ; Bahr, Ryan ; Georgiadis, Apostolos ; Goussetis, George ; Tentzeris, Manos M.</creatorcontrib><description>Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{W} &lt;/tex-math&gt;&lt;/inline-formula&gt;-level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of "Green IoT" and "Low Carbon" smart home, smart city, smart skin, and machine-to-machine (M2M) applications.</description><identifier>ISSN: 0018-9219</identifier><identifier>EISSN: 1558-2256</identifier><identifier>DOI: 10.1109/JPROC.2021.3125285</identifier><identifier>CODEN: IEEPAD</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Additive manufacturing ; Antenna design ; Antennas ; Backscatter ; backscatter communication ; Backscattering ; Circuits ; Communication ; Design optimization ; Energy harvesting ; energy harvesting (EH) ; Flexible components ; flexible electronics ; Frequency shift keying ; Inkjet printing ; Internet of Things ; Internet of Things (IoT) ; Millimeter waves ; Modulators ; OFDM ; Packaging ; Power management ; Radio frequency ; Smart buildings ; Waveforms ; Wireless communication ; wireless power transfer (WPT) ; Wireless power transmission ; wireless sensor network (WSN) ; Wireless sensor networks</subject><ispartof>Proceedings of the IEEE, 2022-01, Vol.110 (1), p.171-192</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2022</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c454t-70380f70e628a3e46be741e8bf40ed8e24a766019b7b72f49539e631ed4712c63</citedby><cites>FETCH-LOGICAL-c454t-70380f70e628a3e46be741e8bf40ed8e24a766019b7b72f49539e631ed4712c63</cites><orcidid>0000-0002-5953-3800 ; 0000-0003-0054-8167 ; 0000-0002-3444-5978 ; 0000-0001-8735-3156 ; 0000-0002-1368-5059 ; 0000-0002-4580-012X ; 0000-0003-3807-020X ; 0000-0002-8042-2347 ; 0000-0003-0476-3577</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/9614657$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids></links><search><creatorcontrib>Song, Chaoyun</creatorcontrib><creatorcontrib>Ding, Yuan</creatorcontrib><creatorcontrib>Eid, Aline</creatorcontrib><creatorcontrib>Hester, Jimmy G. D.</creatorcontrib><creatorcontrib>He, Xuanke</creatorcontrib><creatorcontrib>Bahr, Ryan</creatorcontrib><creatorcontrib>Georgiadis, Apostolos</creatorcontrib><creatorcontrib>Goussetis, George</creatorcontrib><creatorcontrib>Tentzeris, Manos M.</creatorcontrib><title>Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics</title><title>Proceedings of the IEEE</title><addtitle>JPROC</addtitle><description>Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{W} &lt;/tex-math&gt;&lt;/inline-formula&gt;-level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of "Green IoT" and "Low Carbon" smart home, smart city, smart skin, and machine-to-machine (M2M) applications.</description><subject>Additive manufacturing</subject><subject>Antenna design</subject><subject>Antennas</subject><subject>Backscatter</subject><subject>backscatter communication</subject><subject>Backscattering</subject><subject>Circuits</subject><subject>Communication</subject><subject>Design optimization</subject><subject>Energy harvesting</subject><subject>energy harvesting (EH)</subject><subject>Flexible components</subject><subject>flexible electronics</subject><subject>Frequency shift keying</subject><subject>Inkjet printing</subject><subject>Internet of Things</subject><subject>Internet of Things (IoT)</subject><subject>Millimeter waves</subject><subject>Modulators</subject><subject>OFDM</subject><subject>Packaging</subject><subject>Power management</subject><subject>Radio frequency</subject><subject>Smart buildings</subject><subject>Waveforms</subject><subject>Wireless communication</subject><subject>wireless power transfer (WPT)</subject><subject>Wireless power transmission</subject><subject>wireless sensor network (WSN)</subject><subject>Wireless sensor networks</subject><issn>0018-9219</issn><issn>1558-2256</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2022</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNo9kEtLw0AUhQdRsFb_gG4GXKed9yTuamx9UGgpisuQx41MTWfqTKoW_7ypLa4uF853DnwIXVIyoJQkw6f5YpYOGGF0wCmTLJZHqEeljCPGpDpGPUJoHCWMJqfoLIQlIYRLxXvoZ1R95raEgI3Fr8ZDAyE0Wzx3X-Chwrd5-R7KvG3B49StVhtrus84G27wxLsVHtkWrM2HiwlOjS83pvVbfAfBvFncOjz3pgtUeNLAtykawOMGyta7riaco5M6bwJcHG4fvUzGz-lDNJ3dP6ajaVQKKdpIEx6TWhNQLM45CFWAFhTiohYEqhiYyLVShCaFLjSrRSJ5AopTqISmrFS8j673vWvvPjYQ2mzpNt52kxlTVIuE8W6jj9g-VXoXgoc6W3uzyv02oyTbSc7-JGc7ydlBcgdd7SEDAP9AoqhQUvNfEaB5QQ</recordid><startdate>202201</startdate><enddate>202201</enddate><creator>Song, Chaoyun</creator><creator>Ding, Yuan</creator><creator>Eid, Aline</creator><creator>Hester, Jimmy G. D.</creator><creator>He, Xuanke</creator><creator>Bahr, Ryan</creator><creator>Georgiadis, Apostolos</creator><creator>Goussetis, George</creator><creator>Tentzeris, Manos M.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>ESBDL</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0002-5953-3800</orcidid><orcidid>https://orcid.org/0000-0003-0054-8167</orcidid><orcidid>https://orcid.org/0000-0002-3444-5978</orcidid><orcidid>https://orcid.org/0000-0001-8735-3156</orcidid><orcidid>https://orcid.org/0000-0002-1368-5059</orcidid><orcidid>https://orcid.org/0000-0002-4580-012X</orcidid><orcidid>https://orcid.org/0000-0003-3807-020X</orcidid><orcidid>https://orcid.org/0000-0002-8042-2347</orcidid><orcidid>https://orcid.org/0000-0003-0476-3577</orcidid></search><sort><creationdate>202201</creationdate><title>Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics</title><author>Song, Chaoyun ; Ding, Yuan ; Eid, Aline ; Hester, Jimmy G. D. ; He, Xuanke ; Bahr, Ryan ; Georgiadis, Apostolos ; Goussetis, George ; Tentzeris, Manos M.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c454t-70380f70e628a3e46be741e8bf40ed8e24a766019b7b72f49539e631ed4712c63</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2022</creationdate><topic>Additive manufacturing</topic><topic>Antenna design</topic><topic>Antennas</topic><topic>Backscatter</topic><topic>backscatter communication</topic><topic>Backscattering</topic><topic>Circuits</topic><topic>Communication</topic><topic>Design optimization</topic><topic>Energy harvesting</topic><topic>energy harvesting (EH)</topic><topic>Flexible components</topic><topic>flexible electronics</topic><topic>Frequency shift keying</topic><topic>Inkjet printing</topic><topic>Internet of Things</topic><topic>Internet of Things (IoT)</topic><topic>Millimeter waves</topic><topic>Modulators</topic><topic>OFDM</topic><topic>Packaging</topic><topic>Power management</topic><topic>Radio frequency</topic><topic>Smart buildings</topic><topic>Waveforms</topic><topic>Wireless communication</topic><topic>wireless power transfer (WPT)</topic><topic>Wireless power transmission</topic><topic>wireless sensor network (WSN)</topic><topic>Wireless sensor networks</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Song, Chaoyun</creatorcontrib><creatorcontrib>Ding, Yuan</creatorcontrib><creatorcontrib>Eid, Aline</creatorcontrib><creatorcontrib>Hester, Jimmy G. D.</creatorcontrib><creatorcontrib>He, Xuanke</creatorcontrib><creatorcontrib>Bahr, Ryan</creatorcontrib><creatorcontrib>Georgiadis, Apostolos</creatorcontrib><creatorcontrib>Goussetis, George</creatorcontrib><creatorcontrib>Tentzeris, Manos M.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE Open Access Journals</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Proceedings of the IEEE</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Song, Chaoyun</au><au>Ding, Yuan</au><au>Eid, Aline</au><au>Hester, Jimmy G. D.</au><au>He, Xuanke</au><au>Bahr, Ryan</au><au>Georgiadis, Apostolos</au><au>Goussetis, George</au><au>Tentzeris, Manos M.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics</atitle><jtitle>Proceedings of the IEEE</jtitle><stitle>JPROC</stitle><date>2022-01</date><risdate>2022</risdate><volume>110</volume><issue>1</issue><spage>171</spage><epage>192</epage><pages>171-192</pages><issn>0018-9219</issn><eissn>1558-2256</eissn><coden>IEEPAD</coden><abstract>Backscatter communication is an emerging paradigm for pervasive connectivity of low-power communication devices. Wirelessly powered backscattering wireless sensor networks (WSNs) become particularly important to meet the upcoming era of the Internet of Things (IoT), which requires the massive deployment of self-sustainable and maintenance-free low-cost sensing and communication devices. This article will introduce the state-of-the-art antenna design and radio frequency (RF) system integration for wirelessly powered backscatter communications, covering both the node and the base unit. We capture the latest development in ultralow-power RF front ends and coding schemes for &lt;inline-formula&gt; &lt;tex-math notation="LaTeX"&gt;\mu \text{W} &lt;/tex-math&gt;&lt;/inline-formula&gt;-level backscatter modulators, as well as the latest progress in wireless power transfer (WPT) and energy harvesting (EH) techniques. Newly emerged rectenna system, waveform design, and channel optimization are reviewed in light of the opportunities for adaptively optimizing the WPT/EH efficiency for low-power signals with varying conditions. In addition, advanced device packaging and integration technologies in, e.g., additively manufactured RF components and modules for microwave and millimeter-wave ubiquitous sensing and backscattering energy-autonomous RF structures are reported. Inkjet printing for the sustainable and ultralow-cost fabrication of flexible RF devices and sensors will be reviewed to provide a prospective insight into the future packaging of backscatter communications from the chip-level design to complete system integration. Finally, this article will also address the challenges in fully wireless powered backscatter radio networks and discuss the future directions of backscatter communication in terms of "Green IoT" and "Low Carbon" smart home, smart city, smart skin, and machine-to-machine (M2M) applications.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/JPROC.2021.3125285</doi><tpages>22</tpages><orcidid>https://orcid.org/0000-0002-5953-3800</orcidid><orcidid>https://orcid.org/0000-0003-0054-8167</orcidid><orcidid>https://orcid.org/0000-0002-3444-5978</orcidid><orcidid>https://orcid.org/0000-0001-8735-3156</orcidid><orcidid>https://orcid.org/0000-0002-1368-5059</orcidid><orcidid>https://orcid.org/0000-0002-4580-012X</orcidid><orcidid>https://orcid.org/0000-0003-3807-020X</orcidid><orcidid>https://orcid.org/0000-0002-8042-2347</orcidid><orcidid>https://orcid.org/0000-0003-0476-3577</orcidid><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 0018-9219
ispartof Proceedings of the IEEE, 2022-01, Vol.110 (1), p.171-192
issn 0018-9219
1558-2256
language eng
recordid cdi_ieee_primary_9614657
source IEEE Electronic Library (IEL)
subjects Additive manufacturing
Antenna design
Antennas
Backscatter
backscatter communication
Backscattering
Circuits
Communication
Design optimization
Energy harvesting
energy harvesting (EH)
Flexible components
flexible electronics
Frequency shift keying
Inkjet printing
Internet of Things
Internet of Things (IoT)
Millimeter waves
Modulators
OFDM
Packaging
Power management
Radio frequency
Smart buildings
Waveforms
Wireless communication
wireless power transfer (WPT)
Wireless power transmission
wireless sensor network (WSN)
Wireless sensor networks
title Advances in Wirelessly Powered Backscatter Communications: From Antenna/RF Circuitry Design to Printed Flexible Electronics
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T08%3A11%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_ieee_&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Advances%20in%20Wirelessly%20Powered%20Backscatter%20Communications:%20From%20Antenna/RF%20Circuitry%20Design%20to%20Printed%20Flexible%20Electronics&rft.jtitle=Proceedings%20of%20the%20IEEE&rft.au=Song,%20Chaoyun&rft.date=2022-01&rft.volume=110&rft.issue=1&rft.spage=171&rft.epage=192&rft.pages=171-192&rft.issn=0018-9219&rft.eissn=1558-2256&rft.coden=IEEPAD&rft_id=info:doi/10.1109/JPROC.2021.3125285&rft_dat=%3Cproquest_ieee_%3E2617492370%3C/proquest_ieee_%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=2617492370&rft_id=info:pmid/&rft_ieee_id=9614657&rfr_iscdi=true