Impact of Die Carrier on Reliability of Power LEDs
High power light emitting diodes (LEDs) suffer from heating effects that have a detrimental impact on the devices characteristics. The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as...
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| Veröffentlicht in: | IEEE journal of the Electron Devices Society 2021, Vol.9, p.854-863 |
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| container_title | IEEE journal of the Electron Devices Society |
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| creator | Kyatam, Shusmitha Alves, Luis N. Maslovski, Stanislav Mendes, Joana C. |
| description | High power light emitting diodes (LEDs) suffer from heating effects that have a detrimental impact on the devices characteristics. The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED's lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. The results provide additional knowledge regarding the impact of the carrier on the performance of the LED. |
| doi_str_mv | 10.1109/JEDS.2021.3115027 |
| format | Article |
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The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED's lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. 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The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED's lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. The results provide additional knowledge regarding the impact of the carrier on the performance of the LED.</description><subject>Aluminum nitride</subject><subject>Aluminum oxide</subject><subject>Crystals</subject><subject>Diamond</subject><subject>Diamonds</subject><subject>Emission analysis</subject><subject>Heating systems</subject><subject>High temperature effects</subject><subject>III-V semiconductor materials</subject><subject>Light emitting diodes</subject><subject>packaging</subject><subject>reliability</subject><subject>Reliability analysis</subject><subject>Silicon</subject><subject>Stability analysis</subject><subject>Thermal conductivity</subject><issn>2168-6734</issn><issn>2168-6734</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><sourceid>DOA</sourceid><recordid>eNpNkF1LwzAYhYMoOOZ-gHhT8Lozb77aXMo2dTJQ_LgOaZpIRrfMtEP2703tGOYm4eSc5305CF0DngJgefe8mL9PCSYwpQAck-IMjQiIMhcFZef_3pdo0rZrnE4JQgoxQmS52WnTZcFlc2-zmY7R25iFbfZmG68r3_ju0P--hp-krxbz9gpdON20dnK8x-jzYfExe8pXL4_L2f0qN4yUXW5czSppNTMFNhVUvGYEi5qwWtaVlJRb44TEUrsaJFBjIEnOOVKY0gjgdIyWA7cOeq120W90PKigvfoTQvxSOnbeNFZhanUCccO1YUIUZcGIJuC4NLxk2CbW7cDaxfC9t22n1mEft2l9RXghGcNUyOSCwWViaNto3WkqYNU3rfqmVd-0OjadMjdDxltrT37JWeIV9Bcds3ca</recordid><startdate>2021</startdate><enddate>2021</enddate><creator>Kyatam, Shusmitha</creator><creator>Alves, Luis N.</creator><creator>Maslovski, Stanislav</creator><creator>Mendes, Joana C.</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. 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The use of LED carriers with high thermal conductivity promotes extraction of heat away from the LED junction. Different materials can be used for this purpose, such as alumina, aluminium nitride, and silicon. Diamond has also been gaining momentum for demanding heat management applications. In order to evaluate the impact of the carrier material on the reliability of the devices, the junction temperature of Cree white XLamp XB-D LEDs was obtained with Ansys for various carriers and different LED current levels. The impact of the junction temperature on the LED's lifetime, emission intensity, footprint, and wavelength stability was then evaluated for each carrier based on the datasheet of the devices. 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| source | IEEE Open Access Journals; DOAJ Directory of Open Access Journals; EZB-FREE-00999 freely available EZB journals |
| subjects | Aluminum nitride Aluminum oxide Crystals Diamond Diamonds Emission analysis Heating systems High temperature effects III-V semiconductor materials Light emitting diodes packaging reliability Reliability analysis Silicon Stability analysis Thermal conductivity |
| title | Impact of Die Carrier on Reliability of Power LEDs |
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