New analytic expressions for mutual inductance and resistance of coupled interconnects on lossy silicon substrate

A new analytic model for series mutual impedance of coupled interconnects on lossy silicon substrate is presented. The model includes the frequency-dependent distribution of the current on the silicon substrate (the substrate skin effect). From this model, simple formulas for accurate calculation of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Ymeri, H., Nauwelaers, B., Maex, K., Vandenberghe, S., De Roest, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Coupled mode analysis Coupling circuits Frequency dependence Impedance Inductance Integrated circuit interconnections Mutual coupling Silicon Skin effect Substrates
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