Herringbone-Based TSV Architecture for Clustered Fault Repair and Aging Recovery

Three-dimensional integrated circuits (3-D ICs) utilizing through-silicon via (TSV) technology have many advantages over 2-D ICs, including high bandwidth, high density, and low power consumption. However, TSV, which is a key feature of 3-D ICs, has not only problems due to defects in the manufactur...

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Veröffentlicht in:	IEEE transactions on computer-aided design of integrated circuits and systems 2022-04, Vol.41 (4), p.1142-1153
Hauptverfasser:	Park, Sangmin, Cheong, Minho, Han, Donghyun, Kang, Sungho
Format:	Artikel
Sprache:	eng
Schlagworte:	Aging Circuit faults Computer architecture Hardware Integrated circuits Interconnections Maintenance engineering Manufacturing defects Power consumption Reliability Repair Switches three-dimensional integrated circuits (3-D ICs) through-silicon via (TSV) Through-silicon vias yield enhancement
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