Machine Learning-Based Detection Method for Wafer Test Induced Defects

Wafer test is carried out after integrated circuits (IC) fabrication to screen out bad dies. In addition, the results can be used to identify problems in the fabrication process and improve manufacturing yield. However, the wafer test itself may induce defects to otherwise good dies. Test-induced de...

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Veröffentlicht in:	IEEE transactions on semiconductor manufacturing 2021-05, Vol.34 (2), p.161-167
Hauptverfasser:	Cheng, Ken Chau-Cheung, Chen, Leon Li-Yang, Li, Ji-Wei, Li, Katherine Shu-Min, Tsai, Nova Cheng-Yen, Wang, Sying-Jyan, Huang, Andrew Yi-Ann, Chou, Leon, Lee, Chen-Shiun, Chen, Jwu E., Liang, Hsing-Chung, Hsu, Chun-Lung
Format:	Artikel
Sprache:	eng
Schlagworte:	Acceptance tests Algorithms Defects Fabrication Fault diagnosis Integrated circuits Machine learning Machine learning algorithms Needles site-dependent fault test yield test-induced defects Testing Very large scale integration wafer map Wafer test
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