Systematic Power Integrity Analysis Based on Inductance Decomposition in a Multi-Layered PCB PDN

An approach is presented for power integrity analysis on multi-layer printed circuit boards in this paper. Two critical current paths are analyzed. Inductance decomposition is applied to identify the critical parameters that can influence the PDN input impedance. Two types of stack-ups are used to p...

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Veröffentlicht in:	IEEE electromagnetic compatibility magazine 2020-01, Vol.9 (4), p.80-90
Hauptverfasser:	Zhao, Biyao, Bai, Siqi, Connor, Samuel, Scearce, Stephen, Cocchini, Matteo, Achkir, Brice, Ruehli, Albert, Archambeault, Bruce, Fan, Jun, Drewniak, James
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit boards Circuits Critical current (superconductivity) current path Decomposition Geometry Impedance Inductance Input impedance Integrated circuit modeling Integrity Layout Multilayers Parameter identification PDN impedance Power distribution network Printed circuits Sensitivity analysis Shape Systematics
Online-Zugang:	Volltext
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