New flip-chip assembly system for prototyping and process investigations

The flip-chip assembly technology and a new laboratory stand for investigation of FC bonding processes are presented. The prototype system was developed by Division of Precision and Electronic Product Technology in Institute of Precision and Biomedical Engineering of Warsaw University of Technology,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Drozd, Z., Hackiewicz, H., Jezior, R., Lasocki, J., Lukasik, W., Orzechowski, J., Szwech, M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly systems Biomedical engineering Biomedical measurements Bonding processes Laboratories Mass production Materials testing Position measurement Prototypes Semiconductor device measurement
Online-Zugang:	Volltext bestellen
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