New developments in single pass reflow encapsulant for flip chip application

This paper introduces a series of single pass reflow encapsulants that require no post curing after solder bump reflow. Acting as a flux and an encapsulant, this product performs two functions. First, the material activates the solder bump and metallic bond pad during solder reflow to establish the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Liu, J., Kraszewski, R., Xin Lin, Wong, L., Goh, S.H., Allen, J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Curing Electric shock Flip chip Glass Inorganic materials Materials testing Packaging Robustness Temperature
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