Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics
Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar...
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| creator | Johnson, S.T. |
| description | Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. Basic design guidelines for the practicing engineer are provided. |
| doi_str_mv | 10.1109/STHERM.2001.915184 |
| format | Conference Proceeding |
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Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. 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Basic design guidelines for the practicing engineer are provided.</description><subject>Design engineering</subject><subject>Electronics cooling</subject><subject>Engineering management</subject><subject>Fluid dynamics</subject><subject>Fluid flow</subject><subject>Liquid cooling</subject><subject>Manifolds</subject><subject>Thermal engineering</subject><subject>Thermal management</subject><subject>Thermal management of electronics</subject><isbn>9780780366497</isbn><isbn>0780366492</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2001</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UF1LwzAUDYigzP6BPeUPtCbpx00ex5hOmAg634SRprkumjaadIz9eyvTw_l4uVwOh5A5ZwXnTN2-bNer58dCMMYLxWsuqwuSKZBsYtk0lYIrkqX0wSZUZc2kvCZvi0H7U3KJBqS9HhwG31H0B_fr4UgHOx5D_EwUQ6TaTRo66t33_0E-7mM4vO9pH7qD15Fab80Yw-BMuiGXqH2y2V_OyOvdartc55un-4flYpM7DmLMGwsIslZTR4uNNLIphdEIbY2gBVcCqgZarRgoLcCiUAwBhWkNGg6WlTMyP_911trdV3S9jqfdeYLyB_6EU6M</recordid><startdate>2001</startdate><enddate>2001</enddate><creator>Johnson, S.T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2001</creationdate><title>Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics</title><author>Johnson, S.T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-6e7f7859366ef68c8632caf7b5f7a21927467ba9079a27ef290f7f2cbcfc17e03</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Design engineering</topic><topic>Electronics cooling</topic><topic>Engineering management</topic><topic>Fluid dynamics</topic><topic>Fluid flow</topic><topic>Liquid cooling</topic><topic>Manifolds</topic><topic>Thermal engineering</topic><topic>Thermal management</topic><topic>Thermal management of electronics</topic><toplevel>online_resources</toplevel><creatorcontrib>Johnson, S.T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Johnson, S.T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics</atitle><btitle>Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189)</btitle><stitle>STHERM</stitle><date>2001</date><risdate>2001</risdate><spage>233</spage><epage>244</epage><pages>233-244</pages><isbn>9780780366497</isbn><isbn>0780366492</isbn><abstract>Manifold fluid flow networks are an essential element in cooling systems that distribute forced air or forced liquid cooling to high performance modular electronics. Manifolds represent a specialized design problem, however, and few engineers in the field electronics thermal management are familiar with the basic fluid dynamics concepts that govern flow rate and pressure distribution in manifold systems. The subject paper describes a one dimensional discrete branch point model for manifold analysis. Predicted results are compared with liquid flow test data in the laminar and transitional regimes. CFD simulations are used to assess the validity of selected empirical coefficients. Basic design guidelines for the practicing engineer are provided.</abstract><pub>IEEE</pub><doi>10.1109/STHERM.2001.915184</doi><tpages>12</tpages></addata></record> |
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| identifier | ISBN: 9780780366497 |
| ispartof | Seventeenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.01CH37189), 2001, p.233-244 |
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| language | eng |
| recordid | cdi_ieee_primary_915184 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Design engineering Electronics cooling Engineering management Fluid dynamics Fluid flow Liquid cooling Manifolds Thermal engineering Thermal management Thermal management of electronics |
| title | Analysis of manifold fluid flow networks for air and liquid flow-through modular electronics |
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