A fully-integrated single-chip SOC for Bluetooth
A 0.25 /spl mu/m CMOS IC contains all analog and digital electronics required for a point-to-multipoint Bluetooth node. The circuit includes RF front-end and digital baseband processor, microprocessor and flash memory with software stack. The 41 mm/sup 2/ die has 15 dB noise figure and 2 dBm maximum...
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Veröffentlicht in: | 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177) 2001, p.196-197 |
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container_title | 2001 IEEE International Solid-State Circuits Conference. Digest of Technical Papers. ISSCC (Cat. No.01CH37177) |
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creator | Eynde, F.O. Schmit, J.-J. Charlier, V. Alexandre, R. Sturman, C. Coffin, K. Mollekens, B. Craninckx, J. Terrijn, S. Monterastelli, A. Beerens, S. Goetschalckx, P. Ingels, M. Joos, D. Guncer, S. Pontioglu, A. |
description | A 0.25 /spl mu/m CMOS IC contains all analog and digital electronics required for a point-to-multipoint Bluetooth node. The circuit includes RF front-end and digital baseband processor, microprocessor and flash memory with software stack. The 41 mm/sup 2/ die has 15 dB noise figure and 2 dBm maximum transmitter output, and consumes 125 mW at 2.5 V during receive. |
doi_str_mv | 10.1109/ISSCC.2001.912601 |
format | Article |
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language | eng |
recordid | cdi_ieee_primary_912601 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Analog integrated circuits Baseband Bluetooth CMOS analog integrated circuits CMOS digital integrated circuits CMOS integrated circuits Flash memory Microprocessors Noise figure Radio frequency |
title | A fully-integrated single-chip SOC for Bluetooth |
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