Impact of Implanted Edge Termination on Vertical β-Ga2O3 Schottky Barrier Diodes Under OFF-State Stressing

Both dc and OFF-state stress characteristics of vertical beta-gallium oxide (\beta -Ga 2 O 3 ) Schottky barrier diodes (SBDs) with or without ion-implanted edge termination (ET) were comparatively analyzed in this work. An implanted ET by He and Mg ions can effectively increase breakdown voltage (B...

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Veröffentlicht in:IEEE transactions on electron devices 2020-10, Vol.67 (10), p.3948-3953
Hauptverfasser: Zhang, Yanni, Zhang, Jincheng, Feng, Zhaoqing, Hu, Zhuangzhuang, Chen, Jiabo, Dang, Kui, Yan, Qinglong, Dong, Pengfei, Zhou, Hong, Hao, Yue
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container_issue 10
container_start_page 3948
container_title IEEE transactions on electron devices
container_volume 67
creator Zhang, Yanni
Zhang, Jincheng
Feng, Zhaoqing
Hu, Zhuangzhuang
Chen, Jiabo
Dang, Kui
Yan, Qinglong
Dong, Pengfei
Zhou, Hong
Hao, Yue
description Both dc and OFF-state stress characteristics of vertical beta-gallium oxide (\beta -Ga 2 O 3 ) Schottky barrier diodes (SBDs) with or without ion-implanted edge termination (ET) were comparatively analyzed in this work. An implanted ET by He and Mg ions can effectively increase breakdown voltage (BV) from 0.5 to 1.0 and 1.5 kV, respectively, by sacrificing minimal forward characteristics. However, SBDs with ion ET exhibited a larger degradation than SBDs without ion ET after OFF-state stressing, especially for Mg ion-implanted ET, which caused more severe lattice damage at the edge of the anode by transmission electron microscopy (TEM) verification. The OFF-state characteristics were investigated by conventional measure/stress/measure (MSM) with reverse stress biases applied from −100 to −1000 V. The ion-implanted ET brings two effects on the device characteristics: 1) the increase of Schottky barrier height ( \Phi _{B} ) in both dc and OFF-state stress characteristics caused by the virtual gate-like effect and leading to an increased {V}_{ON} and 2) the increase of {R}_{ON,SP} in the forward dc characteristics is attributed to the increase of anode resistance and lateral depletion.
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An implanted ET by He and Mg ions can effectively increase breakdown voltage (BV) from 0.5 to 1.0 and 1.5 kV, respectively, by sacrificing minimal forward characteristics. However, SBDs with ion ET exhibited a larger degradation than SBDs without ion ET after OFF-state stressing, especially for Mg ion-implanted ET, which caused more severe lattice damage at the edge of the anode by transmission electron microscopy (TEM) verification. The OFF-state characteristics were investigated by conventional measure/stress/measure (MSM) with reverse stress biases applied from −100 to −1000 V. 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An implanted ET by He and Mg ions can effectively increase breakdown voltage (BV) from 0.5 to 1.0 and 1.5 kV, respectively, by sacrificing minimal forward characteristics. However, SBDs with ion ET exhibited a larger degradation than SBDs without ion ET after OFF-state stressing, especially for Mg ion-implanted ET, which caused more severe lattice damage at the edge of the anode by transmission electron microscopy (TEM) verification. The OFF-state characteristics were investigated by conventional measure/stress/measure (MSM) with reverse stress biases applied from −100 to −1000 V. 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source IEEE Electronic Library (IEL)
subjects Anodes
Beta-gallium oxide (β-Ga₂O₃)
Degradation
Depletion
Forward characteristics
Gallium
Gallium oxides
implanted edge termination (ET)
Ions
Lattices
OFF-state stress
Schottky diodes
Stress
vertical Schottky barrier diode (SBD)
title Impact of Implanted Edge Termination on Vertical β-Ga2O3 Schottky Barrier Diodes Under OFF-State Stressing
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