Wetting performance vs. board finish and flux for several Pb-free solder alloys

The move to replace lead in electronic assemblies is rapidly gaining momentum. The driving factors are potential legislation, primarily in Europe, and global market pressures for more environmentally friendly products. This work examines the compatibility of lead free solders and printed wiring boar...

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Bibliographische Detailangaben

Hauptverfasser:	Sattiraju, S.V., Johnson, R.W., Genc, D.Z., Bozack, M.J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Consumer electronics Environmentally friendly manufacturing techniques Europe Globalization Lead Legislation Spectroscopy Surface finishing Wiring
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