Wetting performance vs. board finish and flux for several Pb-free solder alloys
The move to replace lead in electronic assemblies is rapidly gaining momentum. The driving factors are potential legislation, primarily in Europe, and global market pressures for more environmentally friendly products. This work examines the compatibility of lead free solders and printed wiring boar...
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| creator | Sattiraju, S.V. Johnson, R.W. Genc, D.Z. Bozack, M.J. |
| description | The move to replace lead in electronic assemblies is rapidly gaining momentum. The driving factors are potential legislation, primarily in Europe, and global market pressures for more environmentally friendly products. This work examines the compatibility of lead free solders and printed wiring board (PWB) finishes. The solder alloys evaluated were Sn-3.5Ag-1.5In, Sn-3.4Ag-4.8Bi, Sn-3.8Ag-0.7Cu, Sn-3.5Ag and Sn-0.7Cu. The PWB surface finishes were Sn, Ag, Pd, Ni/Au and OSP. Eutectic Sn-37Pb solder was used for baseline comparisons. Surface finishes "as received" and after one reflow cycle in nitrogen with a peak temperature of 260/spl deg/C were studied. Double-sided reflow is common and the ability of the finish to survive at least one reflow cycle prior to assembly is critical. The surface finishes (as-received and after one reflow cycle) were characterized by Rutherford backscattering (RBS), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Wetting balance measurements were used to quantify solder wetting of each finish and alloy. Both a no-clean and a water soluble flux were used in the wetting balance tests. |
| doi_str_mv | 10.1109/IEMT.2000.910735 |
| format | Conference Proceeding |
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The driving factors are potential legislation, primarily in Europe, and global market pressures for more environmentally friendly products. This work examines the compatibility of lead free solders and printed wiring board (PWB) finishes. The solder alloys evaluated were Sn-3.5Ag-1.5In, Sn-3.4Ag-4.8Bi, Sn-3.8Ag-0.7Cu, Sn-3.5Ag and Sn-0.7Cu. The PWB surface finishes were Sn, Ag, Pd, Ni/Au and OSP. Eutectic Sn-37Pb solder was used for baseline comparisons. Surface finishes "as received" and after one reflow cycle in nitrogen with a peak temperature of 260/spl deg/C were studied. Double-sided reflow is common and the ability of the finish to survive at least one reflow cycle prior to assembly is critical. The surface finishes (as-received and after one reflow cycle) were characterized by Rutherford backscattering (RBS), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Wetting balance measurements were used to quantify solder wetting of each finish and alloy. 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The surface finishes (as-received and after one reflow cycle) were characterized by Rutherford backscattering (RBS), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Wetting balance measurements were used to quantify solder wetting of each finish and alloy. Both a no-clean and a water soluble flux were used in the wetting balance tests.</description><subject>Assembly</subject><subject>Consumer electronics</subject><subject>Environmentally friendly manufacturing techniques</subject><subject>Europe</subject><subject>Globalization</subject><subject>Lead</subject><subject>Legislation</subject><subject>Spectroscopy</subject><subject>Surface finishing</subject><subject>Wiring</subject><issn>1089-8190</issn><issn>2576-9626</issn><isbn>9780780364820</isbn><isbn>0780364821</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUN9LwzAYDP4Ay-y7-JR_IPX7miZtHmVMHUzmw8THkSZftNK1I5nD_fcWJhzcPdwd3DF2h1AggnlYLl43RQkAhUGopbpgWalqLYwu9SXLTd3ABKmrpoQrliE0RjRo4IblKX1POahUpQAytv6gw6EbPvmeYhjjzg6O-DEVvB1t9Dx0Q5e-uB0m2f_88snCEx0p2p6_tSJEIp7G3lPktu_HU7pl18H2ifJ_nrH3p8Vm_iJW6-fl_HElOqzLg0BFEqlFZWHaY-o2BHIgSTlXoUVvqcFG18EY7V3Q4EtvpXbeah2oCkbO2P25tyOi7T52OxtP2_Mb8g9orFG6</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Sattiraju, S.V.</creator><creator>Johnson, R.W.</creator><creator>Genc, D.Z.</creator><creator>Bozack, M.J.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2000</creationdate><title>Wetting performance vs. board finish and flux for several Pb-free solder alloys</title><author>Sattiraju, S.V. ; Johnson, R.W. ; Genc, D.Z. ; Bozack, M.J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-15e31eb15a010997bffec03e5cc41a1dae81867f996dcf60d2da36cda66fe4f93</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Assembly</topic><topic>Consumer electronics</topic><topic>Environmentally friendly manufacturing techniques</topic><topic>Europe</topic><topic>Globalization</topic><topic>Lead</topic><topic>Legislation</topic><topic>Spectroscopy</topic><topic>Surface finishing</topic><topic>Wiring</topic><toplevel>online_resources</toplevel><creatorcontrib>Sattiraju, S.V.</creatorcontrib><creatorcontrib>Johnson, R.W.</creatorcontrib><creatorcontrib>Genc, D.Z.</creatorcontrib><creatorcontrib>Bozack, M.J.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Sattiraju, S.V.</au><au>Johnson, R.W.</au><au>Genc, D.Z.</au><au>Bozack, M.J.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Wetting performance vs. board finish and flux for several Pb-free solder alloys</atitle><btitle>Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. 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Double-sided reflow is common and the ability of the finish to survive at least one reflow cycle prior to assembly is critical. The surface finishes (as-received and after one reflow cycle) were characterized by Rutherford backscattering (RBS), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). Wetting balance measurements were used to quantify solder wetting of each finish and alloy. Both a no-clean and a water soluble flux were used in the wetting balance tests.</abstract><pub>IEEE</pub><doi>10.1109/IEMT.2000.910735</doi><tpages>10</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1089-8190 |
| ispartof | Twenty Sixth IEEE/CPMT International Electronics Manufacturing Technology Symposium (Cat. No.00CH37146), 2000, p.253-262 |
| issn | 1089-8190 2576-9626 |
| language | eng |
| recordid | cdi_ieee_primary_910735 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Consumer electronics Environmentally friendly manufacturing techniques Europe Globalization Lead Legislation Spectroscopy Surface finishing Wiring |
| title | Wetting performance vs. board finish and flux for several Pb-free solder alloys |
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