Effect of voids on the reliability of BGA/CSP solder joints

Voids in solder joints have been considered as a defect in electronics assembly. The factors that affect void formation are complex and involve the interaction of many other factors. There are no established standards for void size and void area in a solder joint for it to be deemed defective. Inspe...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yunus, M., Primavera, A., Srihari, K., Pitarresi, J.M.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Failure analysis Frequency Industrial engineering Instruments Mechanical engineering Packaging Robustness Soldering System testing
Online-Zugang:	Volltext bestellen
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