A new wafer-level membrane transfer technique for MEMS deformable mirrors

This paper describes a new technique for transferring an entire wafer-level silicon membrane from one substrate to another. A 1 /spl mu/m thick silicon membrane, 100 mm in diameter, has been successfully transferred without using adhesives or polymers (i.e. wax, epoxy, or photoresist). Smaller or la...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Eui-Hyeok Yang, Wiberg, D.V.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Actuators Biomembranes Electrodes Etching Hafnium Micromechanical devices Polymers Resists Silicon Wafer bonding
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