Simulation of the stencil printing process [solder pastes]

This paper describes the application of advanced computational fluid dynamics (CFD) methods to model the stencil printing process at both macroscopic and microscopic length scales. The solder paste flow is simulated on a macroscopic scale to study flow characteristics of the bulk motion of the whole...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Glinski, G.P., Bailey, C., Pericleous, K.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Apertures Blades Boundary conditions Computational fluid dynamics Computational modeling Filling Microscopy Navier-Stokes equations Printing Viscosity
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