Creep analysis of solder bumped direct chip attach (DCA) on microvia build-up printed circuit board with underfill

The creep analysis of solder-bumped flip-chip on microvia build-up printed circuit board (PCB) with underfill encapsulant subjected to thermal cycling conditions are presented. Emphasis is placed on the effects of the conventional PCB's additional microvia build-up circuits on the solder joint...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lau, J.H., Pan, S.H., Chang, C.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Capacitive sensors Creep History Hysteresis Plastics Printed circuits Soldering Steady-state Thermal stresses
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