Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications

This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials w...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2019-12, Vol.9 (12), p.2482-2489
Hauptverfasser:	Gupta, Anubha A., Soer, Michiel C. M., Taherzadeh-Sani, Mohammad, Cloutier, Sylvain G., Izquierdo, Ricardo
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit boards Dielectrics Electronic packaging Fabrication Integrated circuits Jet printing Microstrip Microstrip line (MSL) Microstrip transmission lines microwave MMIC (circuits) monolithic microwave integrated circuit (MMIC) packaging printed Printed circuits Transmission lines Transmission loss wire bond
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