Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications
This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials w...
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| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2019-12, Vol.9 (12), p.2482-2489 |
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| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
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| creator | Gupta, Anubha A. Soer, Michiel C. M. Taherzadeh-Sani, Mohammad Cloutier, Sylvain G. Izquierdo, Ricardo |
| description | This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials with viscosity ranging from 1-1000 cP, with a printing resolution and alignment precision of 10 and 2 μm, respectively. The length of the printed transmission line is 2 mm, and the S-parameters are measured from 500 MHz to 18 GHz. In this paper, the MSL is first printed on printed circuit board (PCB), and the fabrication process is optimized to reach a transmission loss of 0.3 dB/mm at 18 GHz. Subsequently, the MSL is printed atop an MMIC architecture to achieve a transmission loss under 0.9 dB/mm at 18 GHz. These results clearly show the potential of using direct printing of MSL as an alternative to conventional wire bonding for wide-bandwidth MMIC electronics packaging applications. |
| doi_str_mv | 10.1109/TCPMT.2019.2926652 |
| format | Article |
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M. ; Taherzadeh-Sani, Mohammad ; Cloutier, Sylvain G. ; Izquierdo, Ricardo</creator><creatorcontrib>Gupta, Anubha A. ; Soer, Michiel C. M. ; Taherzadeh-Sani, Mohammad ; Cloutier, Sylvain G. ; Izquierdo, Ricardo</creatorcontrib><description>This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials with viscosity ranging from 1-1000 cP, with a printing resolution and alignment precision of 10 and 2 μm, respectively. The length of the printed transmission line is 2 mm, and the S-parameters are measured from 500 MHz to 18 GHz. In this paper, the MSL is first printed on printed circuit board (PCB), and the fabrication process is optimized to reach a transmission loss of 0.3 dB/mm at 18 GHz. Subsequently, the MSL is printed atop an MMIC architecture to achieve a transmission loss under 0.9 dB/mm at 18 GHz. 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(IEEE) 2019</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c295t-75e76f953e0e59867870b7ee3bbcc99fd8cc04730de66271ef24a453325c3abf3</citedby><cites>FETCH-LOGICAL-c295t-75e76f953e0e59867870b7ee3bbcc99fd8cc04730de66271ef24a453325c3abf3</cites><orcidid>0000-0002-8452-0155 ; 0000-0002-0288-6293</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8754763$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,778,782,794,27907,27908,54741</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/8754763$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Gupta, Anubha A.</creatorcontrib><creatorcontrib>Soer, Michiel C. M.</creatorcontrib><creatorcontrib>Taherzadeh-Sani, Mohammad</creatorcontrib><creatorcontrib>Cloutier, Sylvain G.</creatorcontrib><creatorcontrib>Izquierdo, Ricardo</creatorcontrib><title>Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials with viscosity ranging from 1-1000 cP, with a printing resolution and alignment precision of 10 and 2 μm, respectively. The length of the printed transmission line is 2 mm, and the S-parameters are measured from 500 MHz to 18 GHz. In this paper, the MSL is first printed on printed circuit board (PCB), and the fabrication process is optimized to reach a transmission loss of 0.3 dB/mm at 18 GHz. Subsequently, the MSL is printed atop an MMIC architecture to achieve a transmission loss under 0.9 dB/mm at 18 GHz. These results clearly show the potential of using direct printing of MSL as an alternative to conventional wire bonding for wide-bandwidth MMIC electronics packaging applications.</description><subject>Circuit boards</subject><subject>Dielectrics</subject><subject>Electronic packaging</subject><subject>Fabrication</subject><subject>Integrated circuits</subject><subject>Jet printing</subject><subject>Microstrip</subject><subject>Microstrip line (MSL)</subject><subject>Microstrip transmission lines</subject><subject>microwave</subject><subject>MMIC (circuits)</subject><subject>monolithic microwave integrated circuit (MMIC)</subject><subject>packaging</subject><subject>printed</subject><subject>Printed circuits</subject><subject>Transmission lines</subject><subject>Transmission loss</subject><subject>wire bond</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kE1PAjEQhhujiQT5A3rZxPNiP7bt9kiIigqRw3puumVKirC7tovGf28RwlxmDs87M3kQuiV4TAhWD9V0uajGFBM1pooKwekFGlDCRc5UyS_PM8fXaBTjBqfiJZaYDdDbBEIb223-Cn22DL7pYZVVwTRx52P0bZPNfQMxc23IFt6G9sd8Q7Y09tOsfbPOJl239db0iYw36MqZbYTRqQ_Rx9NjNZ3l8_fnl-lknluqeJ9LDlI4xRlg4KoUspS4lgCsrq1Vyq1Ka3EhGV6BEFQScLQwBWeMcstM7dgQ3R_3dqH92kPs9abdhyad1DRBpCwwx4miRyo9HWMAp7vgdyb8aoL1wZv-96YP3vTJWwrdHUMeAM6BUvJCCsb-AL_NaT0</recordid><startdate>20191201</startdate><enddate>20191201</enddate><creator>Gupta, Anubha A.</creator><creator>Soer, Michiel C. 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M.</creatorcontrib><creatorcontrib>Taherzadeh-Sani, Mohammad</creatorcontrib><creatorcontrib>Cloutier, Sylvain G.</creatorcontrib><creatorcontrib>Izquierdo, Ricardo</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Gupta, Anubha A.</au><au>Soer, Michiel C. M.</au><au>Taherzadeh-Sani, Mohammad</au><au>Cloutier, Sylvain G.</au><au>Izquierdo, Ricardo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2019-12-01</date><risdate>2019</risdate><volume>9</volume><issue>12</issue><spage>2482</spage><epage>2489</epage><pages>2482-2489</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>This paper presents a low-loss microstrip line (MSL), entirely fabricated using aerosol-jet printing (AJP) technology directly to a monolithic microwave integrated circuit (MMIC) chip to achieve high-speed on-chip connectivity. AJP is a direct write fabrication method capable of printing materials with viscosity ranging from 1-1000 cP, with a printing resolution and alignment precision of 10 and 2 μm, respectively. The length of the printed transmission line is 2 mm, and the S-parameters are measured from 500 MHz to 18 GHz. In this paper, the MSL is first printed on printed circuit board (PCB), and the fabrication process is optimized to reach a transmission loss of 0.3 dB/mm at 18 GHz. Subsequently, the MSL is printed atop an MMIC architecture to achieve a transmission loss under 0.9 dB/mm at 18 GHz. These results clearly show the potential of using direct printing of MSL as an alternative to conventional wire bonding for wide-bandwidth MMIC electronics packaging applications.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2019.2926652</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0002-8452-0155</orcidid><orcidid>https://orcid.org/0000-0002-0288-6293</orcidid></addata></record> |
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| language | eng |
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| source | IEEE Electronic Library (IEL) |
| subjects | Circuit boards Dielectrics Electronic packaging Fabrication Integrated circuits Jet printing Microstrip Microstrip line (MSL) Microstrip transmission lines microwave MMIC (circuits) monolithic microwave integrated circuit (MMIC) packaging printed Printed circuits Transmission lines Transmission loss wire bond |
| title | Aerosol-Jet Printed Transmission Lines for Microwave Packaging Applications |
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