Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter

The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of t...

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Veröffentlicht in:	IEEE access 2019, Vol.7, p.72134-72142
Hauptverfasser:	Hu, Yaogang, Shi, Pingping, Li, Hui, Yang, Chao
Format:	Artikel
Sprache:	eng
Schlagworte:	Base plates base-plate solder Condition monitoring Delamination Finite element analysis Finite element method health condition monitoring Infrared imaging Insulated gate bipolar transistors Junctions Modules multi-chip IGBT module Power converters Temperature Temperature distribution Temperature gradients Thermography Three dimensional models Wind power Wind power converters Wind power generation Wind turbines
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