Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter
The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of t...
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| Veröffentlicht in: | IEEE access 2019, Vol.7, p.72134-72142 |
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| creator | Hu, Yaogang Shi, Pingping Li, Hui Yang, Chao |
| description | The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of the base-plate solder fatigue for the IGBT module is introduced based on the case temperature difference. First, according to the structure of the IGBT module, a 3D finite element model is established, and the junction and case temperatures at different delamination degrees are investigated. Second, for defining the degradation degree, identifying the steady-state process, and acquiring the case temperature, an assessment method of the base-plate solder fatigue based on the case temperature difference is established. Finally, taking the experiment of a practical wind turbine converter IGBT module as an example, the assessment process of base-plate solder of the IGBT module is demonstrated, and the results show that the proposed assessment method is correct and effective. |
| doi_str_mv | 10.1109/ACCESS.2019.2918029 |
| format | Article |
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In this paper, a health condition assessment method of the base-plate solder fatigue for the IGBT module is introduced based on the case temperature difference. First, according to the structure of the IGBT module, a 3D finite element model is established, and the junction and case temperatures at different delamination degrees are investigated. Second, for defining the degradation degree, identifying the steady-state process, and acquiring the case temperature, an assessment method of the base-plate solder fatigue based on the case temperature difference is established. Finally, taking the experiment of a practical wind turbine converter IGBT module as an example, the assessment process of base-plate solder of the IGBT module is demonstrated, and the results show that the proposed assessment method is correct and effective.</description><identifier>ISSN: 2169-3536</identifier><identifier>EISSN: 2169-3536</identifier><identifier>DOI: 10.1109/ACCESS.2019.2918029</identifier><identifier>CODEN: IAECCG</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Base plates ; base-plate solder ; Condition monitoring ; Delamination ; Finite element analysis ; Finite element method ; health condition monitoring ; Infrared imaging ; Insulated gate bipolar transistors ; Junctions ; Modules ; multi-chip IGBT module ; Power converters ; Temperature ; Temperature distribution ; Temperature gradients ; Thermography ; Three dimensional models ; Wind power ; Wind power converters ; Wind power generation ; Wind turbines</subject><ispartof>IEEE access, 2019, Vol.7, p.72134-72142</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2019</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c408t-caeb5b57abf42f743b5c89d48292b2276b6af6219df47260cefb74b8ce1a5c123</citedby><cites>FETCH-LOGICAL-c408t-caeb5b57abf42f743b5c89d48292b2276b6af6219df47260cefb74b8ce1a5c123</cites><orcidid>0000-0001-6926-9524</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/8718597$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>314,776,780,860,2096,4010,27610,27900,27901,27902,54908</link.rule.ids></links><search><creatorcontrib>Hu, Yaogang</creatorcontrib><creatorcontrib>Shi, Pingping</creatorcontrib><creatorcontrib>Li, Hui</creatorcontrib><creatorcontrib>Yang, Chao</creatorcontrib><title>Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter</title><title>IEEE access</title><addtitle>Access</addtitle><description>The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of the base-plate solder fatigue for the IGBT module is introduced based on the case temperature difference. First, according to the structure of the IGBT module, a 3D finite element model is established, and the junction and case temperatures at different delamination degrees are investigated. Second, for defining the degradation degree, identifying the steady-state process, and acquiring the case temperature, an assessment method of the base-plate solder fatigue based on the case temperature difference is established. Finally, taking the experiment of a practical wind turbine converter IGBT module as an example, the assessment process of base-plate solder of the IGBT module is demonstrated, and the results show that the proposed assessment method is correct and effective.</description><subject>Base plates</subject><subject>base-plate solder</subject><subject>Condition monitoring</subject><subject>Delamination</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>health condition monitoring</subject><subject>Infrared imaging</subject><subject>Insulated gate bipolar transistors</subject><subject>Junctions</subject><subject>Modules</subject><subject>multi-chip IGBT module</subject><subject>Power converters</subject><subject>Temperature</subject><subject>Temperature distribution</subject><subject>Temperature gradients</subject><subject>Thermography</subject><subject>Three dimensional models</subject><subject>Wind power</subject><subject>Wind power converters</subject><subject>Wind power generation</subject><subject>Wind turbines</subject><issn>2169-3536</issn><issn>2169-3536</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2019</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><sourceid>DOA</sourceid><recordid>eNpNkVFPHCEUhSemTTTWX-ALSZ9nCwwM8LhOrG6i0WRtfCTAXJTNOGyBrem_L3aMkRfIyTnfveE0zTnBK0Kw-rEehsvtdkUxUSuqiMRUHTUnlPSq7XjXf_n0Pm7Oct7hemSVuDhp3DWYqTyjIc5jKCHOaJ0z5PwCc0HRowuTob2fTAG0jdMICfmY0O1hKqEdnsMeba4uHtBtHA8ToDCjxzCP6D6-VmNF_oFUIH1rvnozZTh7v0-bXz8vH4br9ubuajOsb1rHsCytM2C55cJYz6gXrLPcSTUySRW1lIre9sb3lKjRM0F77MBbwax0QAx3hHanzWbhjtHs9D6FF5P-6miC_i_E9KRNKsFNoIVjwnJDMJOWUU6NA2EFJ8wo6ImEyvq-sPYp_j5ALnoXD2mu62vKOO9x_T9RXd3icinmnMB_TCVYv5Wjl3L0Wzn6vZyaOl9SAQA-ElIQySvzH6q8ieM</recordid><startdate>2019</startdate><enddate>2019</enddate><creator>Hu, Yaogang</creator><creator>Shi, Pingping</creator><creator>Li, Hui</creator><creator>Yang, Chao</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>ESBDL</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SC</scope><scope>7SP</scope><scope>7SR</scope><scope>8BQ</scope><scope>8FD</scope><scope>JG9</scope><scope>JQ2</scope><scope>L7M</scope><scope>L~C</scope><scope>L~D</scope><scope>DOA</scope><orcidid>https://orcid.org/0000-0001-6926-9524</orcidid></search><sort><creationdate>2019</creationdate><title>Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter</title><author>Hu, Yaogang ; Shi, Pingping ; Li, Hui ; Yang, Chao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c408t-caeb5b57abf42f743b5c89d48292b2276b6af6219df47260cefb74b8ce1a5c123</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2019</creationdate><topic>Base plates</topic><topic>base-plate solder</topic><topic>Condition monitoring</topic><topic>Delamination</topic><topic>Finite element analysis</topic><topic>Finite element method</topic><topic>health condition monitoring</topic><topic>Infrared imaging</topic><topic>Insulated gate bipolar transistors</topic><topic>Junctions</topic><topic>Modules</topic><topic>multi-chip IGBT module</topic><topic>Power converters</topic><topic>Temperature</topic><topic>Temperature distribution</topic><topic>Temperature gradients</topic><topic>Thermography</topic><topic>Three dimensional models</topic><topic>Wind power</topic><topic>Wind power converters</topic><topic>Wind power generation</topic><topic>Wind turbines</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Hu, Yaogang</creatorcontrib><creatorcontrib>Shi, Pingping</creatorcontrib><creatorcontrib>Li, Hui</creatorcontrib><creatorcontrib>Yang, Chao</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE Open Access Journals</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Computer and Information Systems Abstracts</collection><collection>Electronics & Communications Abstracts</collection><collection>Engineered Materials Abstracts</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>Materials Research Database</collection><collection>ProQuest Computer Science Collection</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>Computer and Information Systems Abstracts Academic</collection><collection>Computer and Information Systems Abstracts Professional</collection><collection>DOAJ Directory of Open Access Journals</collection><jtitle>IEEE access</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Hu, Yaogang</au><au>Shi, Pingping</au><au>Li, Hui</au><au>Yang, Chao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter</atitle><jtitle>IEEE access</jtitle><stitle>Access</stitle><date>2019</date><risdate>2019</risdate><volume>7</volume><spage>72134</spage><epage>72142</epage><pages>72134-72142</pages><issn>2169-3536</issn><eissn>2169-3536</eissn><coden>IAECCG</coden><abstract>The base-plate solder fatigue of the IGBT module is one of the failures of the wind power converter; however, the existing health condition monitoring method based on infrared thermography is difficult to be applied to the actual applications. In this paper, a health condition assessment method of the base-plate solder fatigue for the IGBT module is introduced based on the case temperature difference. First, according to the structure of the IGBT module, a 3D finite element model is established, and the junction and case temperatures at different delamination degrees are investigated. Second, for defining the degradation degree, identifying the steady-state process, and acquiring the case temperature, an assessment method of the base-plate solder fatigue based on the case temperature difference is established. Finally, taking the experiment of a practical wind turbine converter IGBT module as an example, the assessment process of base-plate solder of the IGBT module is demonstrated, and the results show that the proposed assessment method is correct and effective.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/ACCESS.2019.2918029</doi><tpages>9</tpages><orcidid>https://orcid.org/0000-0001-6926-9524</orcidid><oa>free_for_read</oa></addata></record> |
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| source | IEEE Open Access Journals; DOAJ Directory of Open Access Journals; Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals |
| subjects | Base plates base-plate solder Condition monitoring Delamination Finite element analysis Finite element method health condition monitoring Infrared imaging Insulated gate bipolar transistors Junctions Modules multi-chip IGBT module Power converters Temperature Temperature distribution Temperature gradients Thermography Three dimensional models Wind power Wind power converters Wind power generation Wind turbines |
| title | Health Condition Assessment of Base-Plate Solder for Multi-Chip IGBT Module in Wind Power Converter |
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