High heat flux heat pipe mechanism for cooling of electronics

High heat flux heat pipe mechanism for cooling of electronics

This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model w...

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Hauptverfasser: Zuo, Z.J., North, M.T., Wert, K.L.
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Sprache:eng
Schlagworte:
Electronic packaging thermal management
Electronics cooling
Heat pumps
Heat sinks
Heat transfer
Powders
Thermal conductivity
Thermal stresses
USA Councils
Water heating
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North, M.T.
Wert, K.L.
description This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and is solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.
doi_str_mv 10.1109/ITHERM.2000.866180
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Pulsating heat pipes are feasible approaches to removing increasing heat dissipation densities in electronic equipment.</description><subject>Electronic packaging thermal management</subject><subject>Electronics cooling</subject><subject>Heat pumps</subject><subject>Heat sinks</subject><subject>Heat transfer</subject><subject>Powders</subject><subject>Thermal conductivity</subject><subject>Thermal stresses</subject><subject>USA Councils</subject><subject>Water heating</subject><issn>1089-9870</issn><isbn>9780780359123</isbn><isbn>0780359127</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj19LwzAUxQMqOGa_wJ7yBVrvTdI098EHGdMNJoLM55FmyRrpP9oK-u0tVDic83s4HDiMbRAyRKDHw2m_-3jLBABkRms0cMMSKgzMkjmhkLdshWAoJVPAPUvG8WvugsqVJlyxp328VrzyduKh_v5ZqI-95413lW3j2PDQDdx1XR3bK-8C97V309C10Y0P7C7YevTJf67Z58vutN2nx_fXw_b5mEYENaXWCYmhDOBLq8vZrKa8IBGCElYLpNyQshejRZDBEpJQqEsnSaC72BnWbLPsRu_9uR9iY4ff8_JX_gGj5Emm</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Zuo, Z.J.</creator><creator>North, M.T.</creator><creator>Wert, K.L.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2000</creationdate><title>High heat flux heat pipe mechanism for cooling of electronics</title><author>Zuo, Z.J. ; North, M.T. ; Wert, K.L.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i104t-ac231fbf0eba6bebaa695792ff42a62195894ad862f3fa9192416bc3921cdabc3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Electronic packaging thermal management</topic><topic>Electronics cooling</topic><topic>Heat pumps</topic><topic>Heat sinks</topic><topic>Heat transfer</topic><topic>Powders</topic><topic>Thermal conductivity</topic><topic>Thermal stresses</topic><topic>USA Councils</topic><topic>Water heating</topic><toplevel>online_resources</toplevel><creatorcontrib>Zuo, Z.J.</creatorcontrib><creatorcontrib>North, M.T.</creatorcontrib><creatorcontrib>Wert, K.L.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Xplore</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Zuo, Z.J.</au><au>North, M.T.</au><au>Wert, K.L.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>High heat flux heat pipe mechanism for cooling of electronics</atitle><btitle>ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069)</btitle><stitle>ITHERM</stitle><date>2000</date><risdate>2000</risdate><volume>2</volume><spage>122</spage><epage>128 vol. 2</epage><pages>122-128 vol. 2</pages><issn>1089-9870</issn><isbn>9780780359123</isbn><isbn>0780359127</isbn><abstract>This paper discusses an advanced heat pipe mechanism that has the potential of achieving heat flux capabilities over 250 W/cm/sup 2/. The mechanism utilizes thermally driven pulsating two-phase flow to achieve high heat flux capability and heat transfer coefficient. A simplified hydrodynamic model was developed to guide the proof-of-concept heat pipe design. A more detailed numerical model was also developed and is solved to predict the heat pipe's thermal performance. Test results of proof-of-concept heat pipes verified the heat flux capability of the advanced mechanism and the accuracy of the simplified model. 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ispartof ITHERM 2000. The Seventh Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.00CH37069), 2000, Vol.2, p.122-128 vol. 2
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Electronic packaging thermal management
Electronics cooling
Heat pumps
Heat sinks
Heat transfer
Powders
Thermal conductivity
Thermal stresses
USA Councils
Water heating
title High heat flux heat pipe mechanism for cooling of electronics
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