Flexible micro-spring interconnects for high performance probing
Advances in integrated circuit fabrication have given rise to a need for an innovative, inexpensive, yet reliable probing technology with ultra-fine pitch capability. Research teams at Georgia Tech, Xerox PARC, and Nanonexus, Inc. are developing flexible micro-spring structures that can far exceed t...
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| creator | Haemer, J.M. Sitaraman, S.K. Fork, D.K. Chong, F.C. Mok, S. Smith, D.L. Swiatowiec, F. |
| description | Advances in integrated circuit fabrication have given rise to a need for an innovative, inexpensive, yet reliable probing technology with ultra-fine pitch capability. Research teams at Georgia Tech, Xerox PARC, and Nanonexus, Inc. are developing flexible micro-spring structures that can far exceed the packaging and probing needs of the next-generation microelectronic devices. Highly compliant cantilevered springs have been fabricated at pitches as small as 6 /spl mu/m. These micro-springs are designed to accommodate topological variation in probing surfaces while flexing within the elastic regime. The micro-springs have demonstrated reliable electrical contact and mechanical ruggedness. Non-linear finite element models have been developed to understand the deformation of a micro-spring under mechanical loading. Through the models, the probing force versus displacement relation for a spring as well as the internal stress distribution have been determined. Design guidelines have been established to maximize probing force. |
| doi_str_mv | 10.1109/ECTC.2000.853319 |
| format | Conference Proceeding |
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Research teams at Georgia Tech, Xerox PARC, and Nanonexus, Inc. are developing flexible micro-spring structures that can far exceed the packaging and probing needs of the next-generation microelectronic devices. Highly compliant cantilevered springs have been fabricated at pitches as small as 6 /spl mu/m. These micro-springs are designed to accommodate topological variation in probing surfaces while flexing within the elastic regime. The micro-springs have demonstrated reliable electrical contact and mechanical ruggedness. Non-linear finite element models have been developed to understand the deformation of a micro-spring under mechanical loading. Through the models, the probing force versus displacement relation for a spring as well as the internal stress distribution have been determined. 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Through the models, the probing force versus displacement relation for a spring as well as the internal stress distribution have been determined. Design guidelines have been established to maximize probing force.</description><subject>Contacts</subject><subject>Fabrication</subject><subject>Finite element methods</subject><subject>Integrated circuit interconnections</subject><subject>Integrated circuit packaging</subject><subject>Integrated circuit reliability</subject><subject>Integrated circuit technology</subject><subject>Microelectronics</subject><subject>Nanoscale devices</subject><subject>Springs</subject><isbn>9780780359086</isbn><isbn>0780359089</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2000</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotT81qwzAYM4xBR5f76MkvkOyzHTv2bSO026CwS3cusfO59cgfdg7b28_QgUACCSER8sSgYgzM8749tRUHgEpLIZi5I4VpNGQIaUCrDSlS-s4-1LJWpnkgL4cBf4IdkI7BxblMSwzThYZpxejmaUK3JurnSK_hcqULxqzHbnJIlzjbHH0k974bEhb_vCVfh_2pfS-Pn28f7euxDKzha-nQMl17wzTqmnOLTW-Fl8Jp5V0PIBWgd84xg972vJead0IbYRRHmyNiS3a33oCI57xy7OLv-XZT_AGthEl7</recordid><startdate>2000</startdate><enddate>2000</enddate><creator>Haemer, J.M.</creator><creator>Sitaraman, S.K.</creator><creator>Fork, D.K.</creator><creator>Chong, F.C.</creator><creator>Mok, S.</creator><creator>Smith, D.L.</creator><creator>Swiatowiec, F.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>2000</creationdate><title>Flexible micro-spring interconnects for high performance probing</title><author>Haemer, J.M. ; Sitaraman, S.K. ; Fork, D.K. ; Chong, F.C. ; Mok, S. ; Smith, D.L. ; Swiatowiec, F.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-ceb184f918e8422be7db3f53c86fcd00560efccc19efbd2d582a3893962eb6fc3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Contacts</topic><topic>Fabrication</topic><topic>Finite element methods</topic><topic>Integrated circuit interconnections</topic><topic>Integrated circuit packaging</topic><topic>Integrated circuit reliability</topic><topic>Integrated circuit technology</topic><topic>Microelectronics</topic><topic>Nanoscale devices</topic><topic>Springs</topic><toplevel>online_resources</toplevel><creatorcontrib>Haemer, J.M.</creatorcontrib><creatorcontrib>Sitaraman, S.K.</creatorcontrib><creatorcontrib>Fork, D.K.</creatorcontrib><creatorcontrib>Chong, F.C.</creatorcontrib><creatorcontrib>Mok, S.</creatorcontrib><creatorcontrib>Smith, D.L.</creatorcontrib><creatorcontrib>Swiatowiec, F.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Haemer, J.M.</au><au>Sitaraman, S.K.</au><au>Fork, D.K.</au><au>Chong, F.C.</au><au>Mok, S.</au><au>Smith, D.L.</au><au>Swiatowiec, F.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Flexible micro-spring interconnects for high performance probing</atitle><btitle>2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. 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| ispartof | 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070), 2000, p.1157-1163 |
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| language | eng |
| recordid | cdi_ieee_primary_853319 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Contacts Fabrication Finite element methods Integrated circuit interconnections Integrated circuit packaging Integrated circuit reliability Integrated circuit technology Microelectronics Nanoscale devices Springs |
| title | Flexible micro-spring interconnects for high performance probing |
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