Investigation of under bump metallization systems for flip-chip assemblies

The objective of this work was to investigate the quality of Under Bump Metallization (UBM) systems used for solder bump flip chip applications. These three commercial UBM systems were (i)Al/NiV/Cu UBM with print-and-reflow solder, (ii)Ti-W/Cu UBM with electroplated solder and (iii) Electroless Ni/A...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Poi Siong Teo, Yu-Wen Huang, Chih Hang Tung, Marks, M.R., Thiam Beng Lim
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Failure analysis Flip chip Gold Metallization Scanning electron microscopy Temperature Testing Thermal stability Tin Transmission electron microscopy
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