Accurate Inductance Modeling of 3-D Inductor Based on TSV

In this letter, an accurate model for the inductance of 3-D integrated inductor based on through silicon via is proposed. The model, considering both the internal inductance and detailed calculation of redistribution layer inductance, can more precisely obtain the total inductance of 3-D inductor us...

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Veröffentlicht in:	IEEE microwave and wireless components letters 2018-10, Vol.28 (10), p.900-902
Hauptverfasser:	Gou, Shilong, Dong, Gang, Mei, Zheng, Yang, Yintang
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integrated inductor Computational modeling Computing time Design parameters Inductance inductance model Inductors Integrated circuits Interconnections Model accuracy redistribution layers (RDL) Silicon Solid modeling Three dimensional models through silicon via (TSV) Through-silicon vias Wireless communication
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