Enabling DIR (Designing-In-Reliability) through CAD capabilities

Chip designs are continuously getting larger and more complex. In response to these trends, design methodologies and tool requirements used in recent high-performance designs have been changing rapidly. A Design-In Reliability (DIR) Team was formed at SEMATECH and is composed of DIR and CAD tool exp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Potts, B., Hokinson, R., Kang, W., Riley, J., Doman, D., Cano, F., Durrant, N.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chip scale packaging Costs Design automation Design methodology Electrical capacitance tomography Electronic design automation and methodology Instruments Integrated circuit interconnections Risk analysis
Online-Zugang:	Volltext bestellen
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