Modeling and experimental investigation of thermal interaction in the head-disk interface of mr head based recording systems
This paper presents the results of thermal signal modeling, beating and cooling process simulation, and experimental analysis. An analytical model is proposed which takes the head- disk spacing into account and can be used for quantitative analysis of the head-disk systems.
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creator | Qingfang Leng Bo Liu Gongye Zhou Wei Zhang Mydeen, A.S. Yamamoto, T. |
description | This paper presents the results of thermal signal modeling, beating and cooling process simulation, and experimental analysis. An analytical model is proposed which takes the head- disk spacing into account and can be used for quantitative analysis of the head-disk systems. |
doi_str_mv | 10.1109/INTMAG.1999.837107 |
format | Conference Proceeding |
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An analytical model is proposed which takes the head- disk spacing into account and can be used for quantitative analysis of the head-disk systems.</description><subject>Algorithm design and analysis</subject><subject>Analytical models</subject><subject>Cooling</subject><subject>Equations</subject><subject>Head</subject><subject>Laser noise</subject><subject>Memory</subject><subject>Shape measurement</subject><subject>Signal analysis</subject><subject>Thermal conductivity</subject><isbn>0780355555</isbn><isbn>9780780355552</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1999</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9j0sLwjAQhAMi-PwDnvIHrAm1tj2K-DroybuszVajbVqyQRT88fbh2bkMzMewO4xNpPCkFPFsfzwdlltPxnHsRX4oRdhhAxFGwg9q9diY6C4qzYNAykWffQ6FwkybKwejOL5KtDpH4yDj2jyRnL6C04XhRcrdDW3eAIcWkibWpo75DUFNlaZHC1NIsG7ktiH8AoSKW0wKq-pb9CaHOY1YN4WMcPzzIZts1qfVbqoR8VxWn4B9n9sd_l_4BXMyT7A</recordid><startdate>1999</startdate><enddate>1999</enddate><creator>Qingfang Leng</creator><creator>Bo Liu</creator><creator>Gongye Zhou</creator><creator>Wei Zhang</creator><creator>Mydeen, A.S.</creator><creator>Yamamoto, T.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>1999</creationdate><title>Modeling and experimental investigation of thermal interaction in the head-disk interface of mr head based recording systems</title><author>Qingfang Leng ; Bo Liu ; Gongye Zhou ; Wei Zhang ; Mydeen, A.S. ; Yamamoto, T.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_8371073</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Algorithm design and analysis</topic><topic>Analytical models</topic><topic>Cooling</topic><topic>Equations</topic><topic>Head</topic><topic>Laser noise</topic><topic>Memory</topic><topic>Shape measurement</topic><topic>Signal analysis</topic><topic>Thermal conductivity</topic><toplevel>online_resources</toplevel><creatorcontrib>Qingfang Leng</creatorcontrib><creatorcontrib>Bo Liu</creatorcontrib><creatorcontrib>Gongye Zhou</creatorcontrib><creatorcontrib>Wei Zhang</creatorcontrib><creatorcontrib>Mydeen, A.S.</creatorcontrib><creatorcontrib>Yamamoto, T.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Qingfang Leng</au><au>Bo Liu</au><au>Gongye Zhou</au><au>Wei Zhang</au><au>Mydeen, A.S.</au><au>Yamamoto, T.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Modeling and experimental investigation of thermal interaction in the head-disk interface of mr head based recording systems</atitle><btitle>IEEE International Magnetics Conference</btitle><stitle>INTMAG</stitle><date>1999</date><risdate>1999</risdate><spage>AB06</spage><epage>AB06</epage><pages>AB06-AB06</pages><isbn>0780355555</isbn><isbn>9780780355552</isbn><abstract>This paper presents the results of thermal signal modeling, beating and cooling process simulation, and experimental analysis. An analytical model is proposed which takes the head- disk spacing into account and can be used for quantitative analysis of the head-disk systems.</abstract><pub>IEEE</pub><doi>10.1109/INTMAG.1999.837107</doi></addata></record> |
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identifier | ISBN: 0780355555 |
ispartof | IEEE International Magnetics Conference, 1999, p.AB06-AB06 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Algorithm design and analysis Analytical models Cooling Equations Head Laser noise Memory Shape measurement Signal analysis Thermal conductivity |
title | Modeling and experimental investigation of thermal interaction in the head-disk interface of mr head based recording systems |
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