Integration of large-scale FPGA and DRAM in a package using chip-on-chip technology

A field-programmable multi-chip module containing one ORCA 3T/125 FPGA and 4 MByte DRAM was built using chip-on-chip technology. Module architecture and physical design issues are presented. A PCI board consisting of four chip-on-chip modules is also built as the test vehicle. The design environment...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wang, M.X., Suzuki, K., Dai, W.W.-M., Low, Y.L., O'Conner, K.J., Tai, K.L.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	CMOS logic circuits CMOS technology Computer architecture Costs Field programmable gate arrays Large scale integration Logic devices Packaging Random access memory Silicon
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