Electroless Ni-P and Ni-W-P films as a barrier for thermostimulated diffusion of gold into semiconductor

Amorphous electroless Ni-P films rich in phosphorus content were shown to be better diffusion barrier to the thermostimulated diffusion of gold into substrates than vacuum deposited pure nickel films the same thickness. The authors of the present paper are quite experienced in theory and practice of...

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Bibliographische Detailangaben

Hauptverfasser:	Stepanova, L.I., Bodrkh, T.I., Sviridov, V.V.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Amorphous materials Chemicals Etching Gold alloys Heating Microstructure Nickel alloys Semiconductor films Substrates Vacuum arcs
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