A Novel Package Lid Using Mushroom-Type EBG Structures for Unintentional Radiation Mitigation

Conventional package lid induces additional unintentional radiation due to the resonances between the conventional metal lid and ground plane on package board. In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structu...

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Veröffentlicht in:	IEEE transactions on electromagnetic compatibility 2018-12, Vol.60 (6), p.1882-1888
Hauptverfasser:	Yang, Xiao-Li, Zhang, Le, Li, Yong-Sheng, Jin, Hang, Cheng, Ping, Li, Yan, Li, Er-Ping
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit design Circuits Computer simulation Electromagnetic waveguides Equivalent circuits Ground plane Integrated circuit modeling Lumped-element circuit model Metals Metamaterials mushroom-type electromagnetic bandgap (EBG) structures package lid Periodic structures Resonant frequency unintentional radiation
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