A Novel Package Lid Using Mushroom-Type EBG Structures for Unintentional Radiation Mitigation
Conventional package lid induces additional unintentional radiation due to the resonances between the conventional metal lid and ground plane on package board. In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structu...
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| Veröffentlicht in: | IEEE transactions on electromagnetic compatibility 2018-12, Vol.60 (6), p.1882-1888 |
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| container_end_page | 1888 |
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| container_issue | 6 |
| container_start_page | 1882 |
| container_title | IEEE transactions on electromagnetic compatibility |
| container_volume | 60 |
| creator | Yang, Xiao-Li Zhang, Le Li, Yong-Sheng Jin, Hang Cheng, Ping Li, Yan Li, Er-Ping |
| description | Conventional package lid induces additional unintentional radiation due to the resonances between the conventional metal lid and ground plane on package board. In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structures to mitigate the increased unintentional emission. In addition, a scalable equivalent circuit model is presented as an assistance for designing the proposed package lid. Both the simulation and measurement results confirm that the proposed lid can significantly reduce the unintentional radiation within the specific frequency range as designed. |
| doi_str_mv | 10.1109/TEMC.2017.2765689 |
| format | Article |
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In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structures to mitigate the increased unintentional emission. In addition, a scalable equivalent circuit model is presented as an assistance for designing the proposed package lid. 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In this paper, a novel package lid is proposed based on the gap waveguide theory, which adopts mushroom-type electromagnetic bandgap structures to mitigate the increased unintentional emission. In addition, a scalable equivalent circuit model is presented as an assistance for designing the proposed package lid. Both the simulation and measurement results confirm that the proposed lid can significantly reduce the unintentional radiation within the specific frequency range as designed.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/TEMC.2017.2765689</doi><tpages>7</tpages><orcidid>https://orcid.org/0000-0003-0461-2728</orcidid><orcidid>https://orcid.org/0000-0001-9281-368X</orcidid><orcidid>https://orcid.org/0000-0002-5006-7399</orcidid><orcidid>https://orcid.org/0000-0002-1923-2704</orcidid><orcidid>https://orcid.org/0000-0002-1156-5125</orcidid></addata></record> |
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| ispartof | IEEE transactions on electromagnetic compatibility, 2018-12, Vol.60 (6), p.1882-1888 |
| issn | 0018-9375 1558-187X |
| language | eng |
| recordid | cdi_ieee_primary_8103874 |
| source | IEEE Electronic Library (IEL) |
| subjects | Circuit design Circuits Computer simulation Electromagnetic waveguides Equivalent circuits Ground plane Integrated circuit modeling Lumped-element circuit model Metals Metamaterials mushroom-type electromagnetic bandgap (EBG) structures package lid Periodic structures Resonant frequency unintentional radiation |
| title | A Novel Package Lid Using Mushroom-Type EBG Structures for Unintentional Radiation Mitigation |
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