Yield improvement at the contact process through run-to-run control

This paper reports on part of an effort to improve the yield of a contact process through run-to-run (R2R) control. The two crucial processes involved are chemical mechanical polishing (CMP) and reactive ion etching (RIE). In this paper, the CMP process control element is considered in detail. Empir...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Khan, K., El Chemali, C., Moyne, J., Chapple-Sokol, J., Nadeau, R., Smith, P., Colt, J., Parikh, T.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Chemical vapor deposition Control systems Etching Metrology Microelectronics Noise measurement Process control Production facilities Semiconductor process modeling Thickness control
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