Application of a new laser scanning pattern wafer inspection tool to leading edge memory and logic applications at Infineon Technologies

A new patterned wafer laser-based inspection tool has been introduced to the market place, incorporating double darkfield laser scanning technology. Developed from a well-known production-proven platform, the new system is intended to provide the sensitivity required for 0.18 /spl mu/m design rules,...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Reuter, T., Bohmler, U., Steck, S., McLaren, M., Siqun Xiao, Howland Pinto, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Etching Inspection Light scattering Lighting Logic design Microelectronics Optical scattering Optical sensors Production Software algorithms
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