A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package
This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and anten...
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| Veröffentlicht in: | IEEE antennas and wireless propagation letters 2017-01, Vol.16, p.2416-2419 |
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| container_title | IEEE antennas and wireless propagation letters |
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| creator | Yexi Song Yunqiu Wu Jie Yang Yin Tian Wei Tong Yijun Chen Cetian Wang Xiaohong Tang Benedikt, Johannes Kai Kang |
| description | This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm 2 . Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers. |
| doi_str_mv | 10.1109/LAWP.2017.2721956 |
| format | Article |
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A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm 2 . Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.</description><identifier>ISSN: 1536-1225</identifier><identifier>EISSN: 1548-5757</identifier><identifier>DOI: 10.1109/LAWP.2017.2721956</identifier><identifier>CODEN: IAWPA7</identifier><language>eng</language><publisher>New York: IEEE</publisher><subject>Active integrated antenna (AIA) ; Amplification ; antenna in package ; Antenna measurements ; Antennas ; Bonding ; Ceramics ; Design ; Electronics industry ; GaAs amplifier ; Gain ; Gallium arsenide ; Impedance ; Patch antennas ; Receivers & amplifiers ; Transmission loss ; Wire ; Wires</subject><ispartof>IEEE antennas and wireless propagation letters, 2017-01, Vol.16, p.2416-2419</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2017</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c336t-85eb1258cb6058e57d63c17bc411e55e0df894c8e5bd27ed05e22be8a1be46683</citedby><cites>FETCH-LOGICAL-c336t-85eb1258cb6058e57d63c17bc411e55e0df894c8e5bd27ed05e22be8a1be46683</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7964664$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>314,780,784,796,27923,27924,54757</link.rule.ids></links><search><creatorcontrib>Yexi Song</creatorcontrib><creatorcontrib>Yunqiu Wu</creatorcontrib><creatorcontrib>Jie Yang</creatorcontrib><creatorcontrib>Yin Tian</creatorcontrib><creatorcontrib>Wei Tong</creatorcontrib><creatorcontrib>Yijun Chen</creatorcontrib><creatorcontrib>Cetian Wang</creatorcontrib><creatorcontrib>Xiaohong Tang</creatorcontrib><creatorcontrib>Benedikt, Johannes</creatorcontrib><creatorcontrib>Kai Kang</creatorcontrib><title>A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package</title><title>IEEE antennas and wireless propagation letters</title><addtitle>LAWP</addtitle><description>This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm 2 . Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.</description><subject>Active integrated antenna (AIA)</subject><subject>Amplification</subject><subject>antenna in package</subject><subject>Antenna measurements</subject><subject>Antennas</subject><subject>Bonding</subject><subject>Ceramics</subject><subject>Design</subject><subject>Electronics industry</subject><subject>GaAs amplifier</subject><subject>Gain</subject><subject>Gallium arsenide</subject><subject>Impedance</subject><subject>Patch antennas</subject><subject>Receivers & amplifiers</subject><subject>Transmission loss</subject><subject>Wire</subject><subject>Wires</subject><issn>1536-1225</issn><issn>1548-5757</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNo9kM1OwzAQhC0EEqXwAIiLJc4pXju2k2OooFRUogegR8txNiWl-cFJkXh7HBVx2tHuzI70EXINbAbA0rtVtlnPOAM945pDKtUJmYCMk0hqqU9HLVQEnMtzctH3OxacSooJec_ovK076wb6bKN72xQ0c0P1jXTZDLj1dsCwCbJpLN1Uwwe1dGGznmZ1t6_KCj2tmrCbo7d15ejauk-7xUtyVtp9j1d_c0reHh9e50_R6mWxnGeryAmhhiiRmAOXicsVkwlKXSjhQOcuBkApkRVlksYuXPKCayyYRM5zTCzkGCuViCm5Pf7tfPt1wH4wu_bgm1BpIBWcC8YhDi44upxv-95jaTpf1db_GGBmxGdGfGbEZ_7whczNMVMh4r9fpyr0xuIXsmFphQ</recordid><startdate>20170101</startdate><enddate>20170101</enddate><creator>Yexi Song</creator><creator>Yunqiu Wu</creator><creator>Jie Yang</creator><creator>Yin Tian</creator><creator>Wei Tong</creator><creator>Yijun Chen</creator><creator>Cetian Wang</creator><creator>Xiaohong Tang</creator><creator>Benedikt, Johannes</creator><creator>Kai Kang</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>ESBDL</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20170101</creationdate><title>A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package</title><author>Yexi Song ; Yunqiu Wu ; Jie Yang ; Yin Tian ; Wei Tong ; Yijun Chen ; Cetian Wang ; Xiaohong Tang ; Benedikt, Johannes ; Kai Kang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c336t-85eb1258cb6058e57d63c17bc411e55e0df894c8e5bd27ed05e22be8a1be46683</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Active integrated antenna (AIA)</topic><topic>Amplification</topic><topic>antenna in package</topic><topic>Antenna measurements</topic><topic>Antennas</topic><topic>Bonding</topic><topic>Ceramics</topic><topic>Design</topic><topic>Electronics industry</topic><topic>GaAs amplifier</topic><topic>Gain</topic><topic>Gallium arsenide</topic><topic>Impedance</topic><topic>Patch antennas</topic><topic>Receivers & amplifiers</topic><topic>Transmission loss</topic><topic>Wire</topic><topic>Wires</topic><toplevel>online_resources</toplevel><creatorcontrib>Yexi Song</creatorcontrib><creatorcontrib>Yunqiu Wu</creatorcontrib><creatorcontrib>Jie Yang</creatorcontrib><creatorcontrib>Yin Tian</creatorcontrib><creatorcontrib>Wei Tong</creatorcontrib><creatorcontrib>Yijun Chen</creatorcontrib><creatorcontrib>Cetian Wang</creatorcontrib><creatorcontrib>Xiaohong Tang</creatorcontrib><creatorcontrib>Benedikt, Johannes</creatorcontrib><creatorcontrib>Kai Kang</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE Open Access Journals</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE antennas and wireless propagation letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Yexi Song</au><au>Yunqiu Wu</au><au>Jie Yang</au><au>Yin Tian</au><au>Wei Tong</au><au>Yijun Chen</au><au>Cetian Wang</au><au>Xiaohong Tang</au><au>Benedikt, Johannes</au><au>Kai Kang</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package</atitle><jtitle>IEEE antennas and wireless propagation letters</jtitle><stitle>LAWP</stitle><date>2017-01-01</date><risdate>2017</risdate><volume>16</volume><spage>2416</spage><epage>2419</epage><pages>2416-2419</pages><issn>1536-1225</issn><eissn>1548-5757</eissn><coden>IAWPA7</coden><abstract>This letter presents the design of a Ka-band active integrated antenna in package (AIAiP). A monolithic microwave integrated circuit amplifier based on the GaAs process and a compact patch antenna based on the printed circuit board process are implemented, respectively. Then, the amplifier and antenna are assembled together in a specified package using the wire-bond process. Thus, compared to the traditional solutions, the transmission loss and the size of the proposed AIAiP are significantly reduced. Furthermore, the influence of the bonding wire and the package is taken into account in the design of the amplifier and the antenna, respectively. A good agreement between the simulation and measurement results can be observed. The proposed AIAiP occupies a compact size of 7 × 7 mm 2 . Meanwhile, it achieves -10-dB impedance bandwidth from 33.4 to 37.2 GHz and a peak gain of 18.9 dBi at 35 GHz. Additionally, the impact of the package size on the antenna performance has been demonstrated for future AIA designers.</abstract><cop>New York</cop><pub>IEEE</pub><doi>10.1109/LAWP.2017.2721956</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record> |
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| subjects | Active integrated antenna (AIA) Amplification antenna in package Antenna measurements Antennas Bonding Ceramics Design Electronics industry GaAs amplifier Gain Gallium arsenide Impedance Patch antennas Receivers & amplifiers Transmission loss Wire Wires |
| title | A Compact Ka-Band Active Integrated Antenna With a GaAs Amplifier in a Ceramic Package |
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