Transit Time Dependent Condition Monitoring of PCBs During Testing for Diagnostics in Electronics Industry

In this paper, a novel planar microwave sensor for nondestructive measurement of strain during testing of printed circuit board (PCBs) is proposed. Planar microstrip patch bridged on both sides with squared split ring resonator is used to measure strain. Measurement of stress of isotropic dielectric...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Veröffentlicht in:	IEEE transactions on industrial electronics (1982) 2018-01, Vol.65 (1), p.553-560
Hauptverfasser:	Ramalingam, Vimal Samsingh, Kanagasabai, Malathi, Sundarsingh, Esther Florence
Format:	Artikel
Sprache:	eng
Schlagworte:	Circuit boards Condition monitoring Correlation analysis Microwave probes Microwave sensors Microwave theory and techniques Monitoring Printed circuit board (PCB) testing Printed circuits Probes Reflectometry Resonant frequency Sensors squared split ring resonator (SSRR) Strain Substrates Testing Time dependence Time domain analysis time-domain reflectometry (TDR) Transit time Young's modulus
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!