Design and Verification of a Structure for Isolating Packaging Stress in SOI MEMS Devices

This paper proposes and verifies a structure for the isolation of packaging stress in silicon-on-insulator-based microelectromechanical systems devices. The packaging-stress isolation structure resides on the handle layer and consists of a circular disk, eight elastic beams, and a support frame. The...

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Veröffentlicht in:	IEEE sensors journal 2017-03, Vol.17 (5), p.1246-1254
Hauptverfasser:	Hao, Yongcun, Yuan, Weizheng, Xie, Jianbing, Shen, Qiang, Chang, Honglong
Format:	Artikel
Sprache:	eng
Schlagworte:	Bonding Gyroscopes MEMS Micromechanical devices Packaging Sensors Silicon-on-insulator Strain Stress stress isolation structure
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