The effect of mold compounds on warpage in LOC package

This paper describes a warpage study on LOC-TSOP memory devices. The main objectives of this study are to evaluate the impact of the mold compound on the package warpage with different sized dies. It was found that the balance of the bending between at the edge side region and at the die attach regi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Minjin Ko, Dongsuk Shin, Myungsun Moon, Inhee Lee, Yongjoon Park, Youngkyu Jung, Chijoong Song
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Electronics packaging Epoxy resins Gold Internal stresses Lab-on-a-chip Microassembly Plastic packaging Temperature Wire
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