The effect of mold compounds on warpage in LOC package
This paper describes a warpage study on LOC-TSOP memory devices. The main objectives of this study are to evaluate the impact of the mold compound on the package warpage with different sized dies. It was found that the balance of the bending between at the edge side region and at the die attach regi...
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| creator | Minjin Ko Dongsuk Shin Myungsun Moon Inhee Lee Yongjoon Park Youngkyu Jung Chijoong Song |
| description | This paper describes a warpage study on LOC-TSOP memory devices. The main objectives of this study are to evaluate the impact of the mold compound on the package warpage with different sized dies. It was found that the balance of the bending between at the edge side region and at the die attach region controls the package warpage. The package tends to bend convex upward at the edge side region and concave downward at the die attach region. The various mold compounds were prepared to study the effect of the components, particularly resin and filler. It has shown that the optimum mold compound can be changed according to the inner structure of the LOC-TSOP. The effect of post mold cure on package warpage was also examined based on the cure rate. |
| doi_str_mv | 10.1109/ECTC.1999.776359 |
| format | Conference Proceeding |
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The main objectives of this study are to evaluate the impact of the mold compound on the package warpage with different sized dies. It was found that the balance of the bending between at the edge side region and at the die attach region controls the package warpage. The package tends to bend convex upward at the edge side region and concave downward at the die attach region. The various mold compounds were prepared to study the effect of the components, particularly resin and filler. It has shown that the optimum mold compound can be changed according to the inner structure of the LOC-TSOP. 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The effect of post mold cure on package warpage was also examined based on the cure rate.</description><subject>Assembly</subject><subject>Electronics packaging</subject><subject>Epoxy resins</subject><subject>Gold</subject><subject>Internal stresses</subject><subject>Lab-on-a-chip</subject><subject>Microassembly</subject><subject>Plastic packaging</subject><subject>Temperature</subject><subject>Wire</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>0780352319</isbn><isbn>9780780352315</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1999</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotj8tKxEAQAAcfYHb1Lp7mBxJ70tOZ9FHC-oDAXuJ5mZ3paHTzIFkR_15hPRV1KSilbg1kxgDfb6qmygwzZ84VSHymkhydS8nlxblagSsBKUfDFyoBKjglArxSq2X5ALAApkxU0byLlraVcNRjq_vxEHUY-2n8GuKix0F_-3nyb6K7QdfbSk8-fP7ptbps_WGRm3-u1evjpqme03r79FI91GlnXH5MDQqLNVHAc1latgQWo4uRLLY2DwTB-z0IGWGPlgSl5bi3wYbIRA7X6u7U7URkN81d7-ef3WkXfwHGFEXM</recordid><startdate>1999</startdate><enddate>1999</enddate><creator>Minjin Ko</creator><creator>Dongsuk Shin</creator><creator>Myungsun Moon</creator><creator>Inhee Lee</creator><creator>Yongjoon Park</creator><creator>Youngkyu Jung</creator><creator>Chijoong Song</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>1999</creationdate><title>The effect of mold compounds on warpage in LOC package</title><author>Minjin Ko ; Dongsuk Shin ; Myungsun Moon ; Inhee Lee ; Yongjoon Park ; Youngkyu Jung ; Chijoong Song</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i172t-13e9e41de0a9884945043d7dd543f42c50caab0e51e9a345e3ef9db4c4cd95573</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1999</creationdate><topic>Assembly</topic><topic>Electronics packaging</topic><topic>Epoxy resins</topic><topic>Gold</topic><topic>Internal stresses</topic><topic>Lab-on-a-chip</topic><topic>Microassembly</topic><topic>Plastic packaging</topic><topic>Temperature</topic><topic>Wire</topic><toplevel>online_resources</toplevel><creatorcontrib>Minjin Ko</creatorcontrib><creatorcontrib>Dongsuk Shin</creatorcontrib><creatorcontrib>Myungsun Moon</creatorcontrib><creatorcontrib>Inhee Lee</creatorcontrib><creatorcontrib>Yongjoon Park</creatorcontrib><creatorcontrib>Youngkyu Jung</creatorcontrib><creatorcontrib>Chijoong Song</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Minjin Ko</au><au>Dongsuk Shin</au><au>Myungsun Moon</au><au>Inhee Lee</au><au>Yongjoon Park</au><au>Youngkyu Jung</au><au>Chijoong Song</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>The effect of mold compounds on warpage in LOC package</atitle><btitle>1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299)</btitle><stitle>ECTC</stitle><date>1999</date><risdate>1999</risdate><spage>1196</spage><epage>1200</epage><pages>1196-1200</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>0780352319</isbn><isbn>9780780352315</isbn><abstract>This paper describes a warpage study on LOC-TSOP memory devices. The main objectives of this study are to evaluate the impact of the mold compound on the package warpage with different sized dies. It was found that the balance of the bending between at the edge side region and at the die attach region controls the package warpage. The package tends to bend convex upward at the edge side region and concave downward at the die attach region. The various mold compounds were prepared to study the effect of the components, particularly resin and filler. It has shown that the optimum mold compound can be changed according to the inner structure of the LOC-TSOP. 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| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0569-5503 |
| ispartof | 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299), 1999, p.1196-1200 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_776359 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Assembly Electronics packaging Epoxy resins Gold Internal stresses Lab-on-a-chip Microassembly Plastic packaging Temperature Wire |
| title | The effect of mold compounds on warpage in LOC package |
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