Development of BGA solder joint vibration fatigue life prediction model

The objective of the present study is to develop a vibration fatigue life prediction model for ball grid array (BGA) solder joint. In this study, 3D global/local finite element models were first constructed with MSC/PATRAN code. For the global model including BGA package soldered onto the printed wi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wong, T.E., Reed, B.A., Cohen, H.M., Chu, D.W.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Electronics packaging Fatigue Finite element methods Life testing Power system harmonics Predictive models Soldering Steady-state Wiring
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