Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions

This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and fut...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205
Hauptverfasser:	Garimella, Suresh V., Persoons, Tim, Weibel, Justin A., Gektin, Vadim
Format:	Artikel
Sprache:	eng
Schlagworte:	Acoustic noise Automobile industry Automotive electronics Automotive engineering Computing time Conferences Consumer electronics Cooling systems Data centers Drivers Electric communication systems Electronic devices Electronic packaging thermal management Enclosures Energy management information and communication networks Information management Liquid cooling Noise control Power efficiency Product design Redwood Thermal management thermal management of electronics Vehicles Wearable technology
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