Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions
This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and fut...
Gespeichert in:
| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1205 |
|---|---|
| container_issue | 8 |
| container_start_page | 1191 |
| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
| container_volume | 7 |
| creator | Garimella, Suresh V. Persoons, Tim Weibel, Justin A. Gektin, Vadim |
| description | This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication Systems and Data Centers held in Redwood City, CA, USA, on November 4-5, 2015. Participants in this workshop represented industry and academia, with backgrounds ranging from data center thermal management and energy efficiency to high-performance computing and liquid cooling, thermal management in wearable and mobile devices, and acoustic noise management. By considering a wide range of electronics cooling applications with different lengths and time scales, this paper identifies both common themes and diverging views in the thermal management community. |
| doi_str_mv | 10.1109/TCPMT.2016.2603600 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_7579186</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>7579186</ieee_id><sourcerecordid>1929527246</sourcerecordid><originalsourceid>FETCH-LOGICAL-c524t-9c4f23c1414842d3cd403856cfcf232fc7e831bd8bcc466c7a8208c7893e7df93</originalsourceid><addsrcrecordid>eNo9kEtPwzAQhC0EElXpH4CLJc4tfiS2ww2FFiq1gkM4W6mzaVMldrGTA_8e96HuZVejb3akQeiRkhmlJHsp8u91MWOEihkThAtCbtCI0VRMeabS2-udkns0CWFP4qSKSMJHyM1bML13tjEBFzvwXdnidWnLLXRge9xYvLS1i3LfOItLW-Hcdd0Q-ZMSTWB21rVu20B4xfmubFuwWwgndjH0gwf83viYcsQf0F1dtgEmlz1GP4t5kX9OV18fy_xtNTUpS_ppZpKacUMTmqiEVdxUCeEqFaY2UWe1kaA43VRqY0wihJGlYkQZqTIOsqozPkbP578H734HCL3eu8HbGKlpxrKUSZaISLEzZbwLwUOtD77pSv-nKdHHbvWpW33sVl-6jaans6kBgKtBpjKjSvB_lG522Q</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1929527246</pqid></control><display><type>article</type><title>Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions</title><source>IEEE Electronic Library (IEL)</source><creator>Garimella, Suresh V. ; Persoons, Tim ; Weibel, Justin A. ; Gektin, Vadim</creator><creatorcontrib>Garimella, Suresh V. ; Persoons, Tim ; Weibel, Justin A. ; Gektin, Vadim</creatorcontrib><description>This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication Systems and Data Centers held in Redwood City, CA, USA, on November 4-5, 2015. Participants in this workshop represented industry and academia, with backgrounds ranging from data center thermal management and energy efficiency to high-performance computing and liquid cooling, thermal management in wearable and mobile devices, and acoustic noise management. By considering a wide range of electronics cooling applications with different lengths and time scales, this paper identifies both common themes and diverging views in the thermal management community.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2016.2603600</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>Piscataway: IEEE</publisher><subject>Acoustic noise ; Automobile industry ; Automotive electronics ; Automotive engineering ; Computing time ; Conferences ; Consumer electronics ; Cooling systems ; Data centers ; Drivers ; Electric communication systems ; Electronic devices ; Electronic packaging thermal management ; Enclosures ; Energy management ; information and communication networks ; Information management ; Liquid cooling ; Noise control ; Power efficiency ; Product design ; Redwood ; Thermal management ; thermal management of electronics ; Vehicles ; Wearable technology</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205</ispartof><rights>Copyright The Institute of Electrical and Electronics Engineers, Inc. (IEEE) 2017</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c524t-9c4f23c1414842d3cd403856cfcf232fc7e831bd8bcc466c7a8208c7893e7df93</citedby><cites>FETCH-LOGICAL-c524t-9c4f23c1414842d3cd403856cfcf232fc7e831bd8bcc466c7a8208c7893e7df93</cites><orcidid>0000-0003-1421-2912</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/7579186$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,780,784,796,27924,27925,54758</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/7579186$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Garimella, Suresh V.</creatorcontrib><creatorcontrib>Persoons, Tim</creatorcontrib><creatorcontrib>Weibel, Justin A.</creatorcontrib><creatorcontrib>Gektin, Vadim</creatorcontrib><title>Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication Systems and Data Centers held in Redwood City, CA, USA, on November 4-5, 2015. Participants in this workshop represented industry and academia, with backgrounds ranging from data center thermal management and energy efficiency to high-performance computing and liquid cooling, thermal management in wearable and mobile devices, and acoustic noise management. By considering a wide range of electronics cooling applications with different lengths and time scales, this paper identifies both common themes and diverging views in the thermal management community.</description><subject>Acoustic noise</subject><subject>Automobile industry</subject><subject>Automotive electronics</subject><subject>Automotive engineering</subject><subject>Computing time</subject><subject>Conferences</subject><subject>Consumer electronics</subject><subject>Cooling systems</subject><subject>Data centers</subject><subject>Drivers</subject><subject>Electric communication systems</subject><subject>Electronic devices</subject><subject>Electronic packaging thermal management</subject><subject>Enclosures</subject><subject>Energy management</subject><subject>information and communication networks</subject><subject>Information management</subject><subject>Liquid cooling</subject><subject>Noise control</subject><subject>Power efficiency</subject><subject>Product design</subject><subject>Redwood</subject><subject>Thermal management</subject><subject>thermal management of electronics</subject><subject>Vehicles</subject><subject>Wearable technology</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2017</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kEtPwzAQhC0EElXpH4CLJc4tfiS2ww2FFiq1gkM4W6mzaVMldrGTA_8e96HuZVejb3akQeiRkhmlJHsp8u91MWOEihkThAtCbtCI0VRMeabS2-udkns0CWFP4qSKSMJHyM1bML13tjEBFzvwXdnidWnLLXRge9xYvLS1i3LfOItLW-Hcdd0Q-ZMSTWB21rVu20B4xfmubFuwWwgndjH0gwf83viYcsQf0F1dtgEmlz1GP4t5kX9OV18fy_xtNTUpS_ppZpKacUMTmqiEVdxUCeEqFaY2UWe1kaA43VRqY0wihJGlYkQZqTIOsqozPkbP578H734HCL3eu8HbGKlpxrKUSZaISLEzZbwLwUOtD77pSv-nKdHHbvWpW33sVl-6jaans6kBgKtBpjKjSvB_lG522Q</recordid><startdate>20170801</startdate><enddate>20170801</enddate><creator>Garimella, Suresh V.</creator><creator>Persoons, Tim</creator><creator>Weibel, Justin A.</creator><creator>Gektin, Vadim</creator><general>IEEE</general><general>The Institute of Electrical and Electronics Engineers, Inc. (IEEE)</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope><orcidid>https://orcid.org/0000-0003-1421-2912</orcidid></search><sort><creationdate>20170801</creationdate><title>Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions</title><author>Garimella, Suresh V. ; Persoons, Tim ; Weibel, Justin A. ; Gektin, Vadim</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c524t-9c4f23c1414842d3cd403856cfcf232fc7e831bd8bcc466c7a8208c7893e7df93</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2017</creationdate><topic>Acoustic noise</topic><topic>Automobile industry</topic><topic>Automotive electronics</topic><topic>Automotive engineering</topic><topic>Computing time</topic><topic>Conferences</topic><topic>Consumer electronics</topic><topic>Cooling systems</topic><topic>Data centers</topic><topic>Drivers</topic><topic>Electric communication systems</topic><topic>Electronic devices</topic><topic>Electronic packaging thermal management</topic><topic>Enclosures</topic><topic>Energy management</topic><topic>information and communication networks</topic><topic>Information management</topic><topic>Liquid cooling</topic><topic>Noise control</topic><topic>Power efficiency</topic><topic>Product design</topic><topic>Redwood</topic><topic>Thermal management</topic><topic>thermal management of electronics</topic><topic>Vehicles</topic><topic>Wearable technology</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Garimella, Suresh V.</creatorcontrib><creatorcontrib>Persoons, Tim</creatorcontrib><creatorcontrib>Weibel, Justin A.</creatorcontrib><creatorcontrib>Gektin, Vadim</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Garimella, Suresh V.</au><au>Persoons, Tim</au><au>Weibel, Justin A.</au><au>Gektin, Vadim</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2017-08-01</date><risdate>2017</risdate><volume>7</volume><issue>8</issue><spage>1191</spage><epage>1205</epage><pages>1191-1205</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>This paper reviews thermal management challenges encountered in a wide range of electronics cooling applications from large-scale (data center and telecommunication) to small-scale systems (personal, portable/wearable, and automotive). This paper identifies drivers for progress and immediate and future challenges based on discussions at the 3rd Workshop on Thermal Management in Telecommunication Systems and Data Centers held in Redwood City, CA, USA, on November 4-5, 2015. Participants in this workshop represented industry and academia, with backgrounds ranging from data center thermal management and energy efficiency to high-performance computing and liquid cooling, thermal management in wearable and mobile devices, and acoustic noise management. By considering a wide range of electronics cooling applications with different lengths and time scales, this paper identifies both common themes and diverging views in the thermal management community.</abstract><cop>Piscataway</cop><pub>IEEE</pub><doi>10.1109/TCPMT.2016.2603600</doi><tpages>15</tpages><orcidid>https://orcid.org/0000-0003-1421-2912</orcidid><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2156-3950 |
| ispartof | IEEE transactions on components, packaging, and manufacturing technology (2011), 2017-08, Vol.7 (8), p.1191-1205 |
| issn | 2156-3950 2156-3985 |
| language | eng |
| recordid | cdi_ieee_primary_7579186 |
| source | IEEE Electronic Library (IEL) |
| subjects | Acoustic noise Automobile industry Automotive electronics Automotive engineering Computing time Conferences Consumer electronics Cooling systems Data centers Drivers Electric communication systems Electronic devices Electronic packaging thermal management Enclosures Energy management information and communication networks Information management Liquid cooling Noise control Power efficiency Product design Redwood Thermal management thermal management of electronics Vehicles Wearable technology |
| title | Electronics Thermal Management in Information and Communications Technologies: Challenges and Future Directions |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T12%3A11%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Electronics%20Thermal%20Management%20in%20Information%20and%20Communications%20Technologies:%20Challenges%20and%20Future%20Directions&rft.jtitle=IEEE%20transactions%20on%20components,%20packaging,%20and%20manufacturing%20technology%20(2011)&rft.au=Garimella,%20Suresh%20V.&rft.date=2017-08-01&rft.volume=7&rft.issue=8&rft.spage=1191&rft.epage=1205&rft.pages=1191-1205&rft.issn=2156-3950&rft.eissn=2156-3985&rft.coden=ITCPC8&rft_id=info:doi/10.1109/TCPMT.2016.2603600&rft_dat=%3Cproquest_RIE%3E1929527246%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1929527246&rft_id=info:pmid/&rft_ieee_id=7579186&rfr_iscdi=true |