Do chip size limits exist for DCA?

Solder joints, the most widely used flip chip on board (FCOB) interconnects, have relatively low structural compliance due to the large thermal expansion mismatch between Si die and organic substrate. The PWB CTE is almost an order of magnitude greater than that of the IC. Under operating and testin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Schubert, A., Dudek, R., Leutenbauer, R., Doring, R., Kloeser, J., Oppermann, H., Michel, B., Reichl, H., Baldwin, D., Qu, J., Sitaraman, S., Swaminathan, M., Wong, C.P., Tummala, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitive sensors Creep Flip chip Integrated circuit testing Joining materials Lead Materials reliability Soldering Thermal expansion Thermomechanical processes
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!