Known Good Die Selection Tradeoffs: A Cost Model

A Monte Carlo simulation model was developed for examining the cost of Known Good Die (KGD) relative to packaged parts, with a focus on identifying the dominant cost drivers. The cost of KGD and packaged devices that go through test and burn-in are studied by varying these key drivers and examining...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Murphy, C.F.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Costs Integrated circuit modeling Integrated circuit packaging Integrated circuit testing Microelectronics Packaging machines Plastic packaging Semiconductor device modeling Sockets
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