Industrial mmWave Radar Sensor in Embedded Wafer-Level BGA Packaging Technology

We present highly integrated 60-GHz radar transceivers for industrial sensor applications. The bistatic and monostatic transceivers are implemented in the SiGe bipolar technology and packaged using the embedded wafer-level ball grid array technology that allows for direct embedding of the antennas i...

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Veröffentlicht in:	IEEE sensors journal 2016-09, Vol.16 (17), p.6566-6578
Hauptverfasser:	Beck, Christopher, Ng, Herman Jalli, Agethen, Roman, PourMousavi, Mehran, Forstner, Hans Peter, Wojnowski, Maciej, Pressel, Klaus, Weigel, Robert, Hagelauer, Amelie, Kissinger, Dietmar
Format:	Artikel
Sprache:	eng
Schlagworte:	Antennas Boards Circuit boards Electronics industry Frequency measurement Gain Millimeter-wave circuits Packages packaging Power generation Radar radar systems Receivers Sensors SiGe RFICs Silicon germanides SiP modules Transceivers Transmitters
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