An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper
An ultra-thin (20 μm), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linea...
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| Veröffentlicht in: | IEEE journal of solid-state circuits 2016-01, Vol.51 (1), p.273-280 |
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| container_title | IEEE journal of solid-state circuits |
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| creator | Mahsereci, Yigit Saller, Stefan Richter, Harald Burghartz, Joachim N. |
| description | An ultra-thin (20 μm), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linearly converted to electrical signals proportional to shear stress and normal stress difference using two sensing elements. Each stress signal is processed and digitized by an integrator and a 10-bit SAR ADC. In contrast to rigid chips, the stress cannot be avoided in the sensitive blocks, such as the signal processing chain and digital controller, when an ultra-thin chip is under deformation. The influence of stress levels, up to 350 MPa, is minimized by using stress-insensitive components, design measures, and layout techniques. This work represents the first demonstration of stress-aware top-to-bottom CMOS design on an ultra-thin chip. |
| doi_str_mv | 10.1109/JSSC.2015.2498183 |
| format | Article |
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The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linearly converted to electrical signals proportional to shear stress and normal stress difference using two sensing elements. Each stress signal is processed and digitized by an integrator and a 10-bit SAR ADC. In contrast to rigid chips, the stress cannot be avoided in the sensitive blocks, such as the signal processing chain and digital controller, when an ultra-thin chip is under deformation. The influence of stress levels, up to 350 MPa, is minimized by using stress-insensitive components, design measures, and layout techniques. This work represents the first demonstration of stress-aware top-to-bottom CMOS design on an ultra-thin chip.</description><subject>Adaptive</subject><subject>bendable</subject><subject>Chips</subject><subject>CMOS</subject><subject>CMOS integrated circuits</subject><subject>Design engineering</subject><subject>Digitization</subject><subject>flexible</subject><subject>Grippers</subject><subject>hybrid systems-in-foil (HySiF)</subject><subject>MOSFET</subject><subject>piezoresistive</subject><subject>Robot sensing systems</subject><subject>robotic</subject><subject>sensor</subject><subject>Sensors</subject><subject>Signal processing</subject><subject>Stress</subject><subject>Stresses</subject><subject>Temperature sensors</subject><subject>ultra-thin</subject><issn>0018-9200</issn><issn>1558-173X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kEFLwzAYhoMoOKc_QLzk6KUzX5qmyXFUN5XJwG7gLaTtV6x0TU060X9vx8TTywvP-x4eQq6BzQCYvnvO82zGGSQzLrQCFZ-QCSSJiiCN307JhDFQkeaMnZOLED7GKoSCCdnOO7ptB2-jzXvT0UWL303RIs1e1jnNB48h0By74Dy9x53rwogOWFHXUdvReWX7oflC-uoKNzQlXfqm79FfkrPatgGv_nJKtouHTfYYrdbLp2y-ikqu1RChQFnyohSC1wljsWWJjisAiVpLq4BBWoGoZVKpomYaLAoNsrAlogQtMZ6S2-Nv793nHsNgdk0osW1th24fDKRKcpBCwojCES29C8FjbXrf7Kz_McDMQaE5KDQHheZP4bi5OW4aRPzn01hwpdL4F8DpbEA</recordid><startdate>201601</startdate><enddate>201601</enddate><creator>Mahsereci, Yigit</creator><creator>Saller, Stefan</creator><creator>Richter, Harald</creator><creator>Burghartz, Joachim N.</creator><general>IEEE</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>8FD</scope><scope>F28</scope><scope>FR3</scope><scope>L7M</scope></search><sort><creationdate>201601</creationdate><title>An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper</title><author>Mahsereci, Yigit ; Saller, Stefan ; Richter, Harald ; Burghartz, Joachim N.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c298t-e4e6c2bc442f5003a0593d116e996a81017d14f65d8bf091ae4916bacee6196e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Adaptive</topic><topic>bendable</topic><topic>Chips</topic><topic>CMOS</topic><topic>CMOS integrated circuits</topic><topic>Design engineering</topic><topic>Digitization</topic><topic>flexible</topic><topic>Grippers</topic><topic>hybrid systems-in-foil (HySiF)</topic><topic>MOSFET</topic><topic>piezoresistive</topic><topic>Robot sensing systems</topic><topic>robotic</topic><topic>sensor</topic><topic>Sensors</topic><topic>Signal processing</topic><topic>Stress</topic><topic>Stresses</topic><topic>Temperature sensors</topic><topic>ultra-thin</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Mahsereci, Yigit</creatorcontrib><creatorcontrib>Saller, Stefan</creatorcontrib><creatorcontrib>Richter, Harald</creatorcontrib><creatorcontrib>Burghartz, Joachim N.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Technology Research Database</collection><collection>ANTE: Abstracts in New Technology & Engineering</collection><collection>Engineering Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE journal of solid-state circuits</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mahsereci, Yigit</au><au>Saller, Stefan</au><au>Richter, Harald</au><au>Burghartz, Joachim N.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper</atitle><jtitle>IEEE journal of solid-state circuits</jtitle><stitle>JSSC</stitle><date>2016-01</date><risdate>2016</risdate><volume>51</volume><issue>1</issue><spage>273</spage><epage>280</epage><pages>273-280</pages><issn>0018-9200</issn><eissn>1558-173X</eissn><coden>IJSCBC</coden><abstract>An ultra-thin (20 μm), flexible CMOS stress sensor for hybrid systems-in-foil (HySiF) is presented. The system is designed for Fin Ray® grippers in order to measure the emerging stress on the gripper in operation, enabling the extraction of object shape and operation status. In-plane stress is linearly converted to electrical signals proportional to shear stress and normal stress difference using two sensing elements. Each stress signal is processed and digitized by an integrator and a 10-bit SAR ADC. In contrast to rigid chips, the stress cannot be avoided in the sensitive blocks, such as the signal processing chain and digital controller, when an ultra-thin chip is under deformation. The influence of stress levels, up to 350 MPa, is minimized by using stress-insensitive components, design measures, and layout techniques. This work represents the first demonstration of stress-aware top-to-bottom CMOS design on an ultra-thin chip.</abstract><pub>IEEE</pub><doi>10.1109/JSSC.2015.2498183</doi><tpages>8</tpages></addata></record> |
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| subjects | Adaptive bendable Chips CMOS CMOS integrated circuits Design engineering Digitization flexible Grippers hybrid systems-in-foil (HySiF) MOSFET piezoresistive Robot sensing systems robotic sensor Sensors Signal processing Stress Stresses Temperature sensors ultra-thin |
| title | An Ultra-Thin Flexible CMOS Stress Sensor Demonstrated on an Adaptive Robotic Gripper |
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