Step-Down Spatial Randomness Test for Detecting Abnormalities in DRAM Wafers with Multiple Spatial Maps

Defects on semiconductor wafers are not uniformly distributed, but tend to cluster. These spatial defect patterns contain useful information about issues during integrated circuit fabrication. Promptly detecting abnormal wafers is an important way to increase yield and product quality. However, rese...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 2016-02, Vol.29 (1), p.57-65
Hauptverfasser: Kim, Byunghoon, Jeong, Young-Seon, Tong, Seung Hoon, Chang, In-Kap, Jeong, Myong-Kee
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Sprache:eng
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