Thermal resistance analysis by induced transient (TRAIT) method for power electronic devices thermal characterization. II. Practice and experiments

For pt.I see ibid., vol.13, no.6, p.1208-19 (1998). The TRAIT method for thermal characterization of electronic devices, whose theory was exposed in part I for one-dimensional (1-D) structures, was here applied to systems having heat fluxes with three-dimensional (3-D) dependence in order to demonst...

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Veröffentlicht in:	IEEE transactions on power electronics 1998-11, Vol.13 (6), p.1220-1228
Hauptverfasser:	Bagnoli, P.E., Casarosa, C., Dallago, E., Nardoni, M.
Format:	Artikel
Sprache:	eng
Schlagworte:	Analytical models Circuit simulation Electronic packaging thermal management Plastic packaging Resistance heating Spatial resolution Steady-state Temperature Thermal resistance Transient analysis
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