The Formation Of Electroplating Molds By Reactive Ion Etching

Polyimide, polymethylmethacrylate (PMMA) and polyester-based polymers were investigated as potential electroplating mold materials. They showed high tensile stress (/spl equiv/10/sup 8/ dyne/cm/sup 2/) after heat treatment at temperatures /spl ges/ 200/spl deg/C. Conventional reactive ion etching te...

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Bibliographische Detailangaben
Hauptverfasser: Shih-Chia Chang, Putty, M.W., Hicks, D.B.
Format: Tagungsbericht
Sprache:eng
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