Electromigration Lifetime Optimization by Uniform Designs and a New Lifetime Index

In this paper, we report electromigration (EM) reliability optimizations using highly efficient uniform design (UD). Considering the large error that results from using a single lifetime index, and the different EM failure modes, we introduce a new proportion index incorporating early failures to co...

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Veröffentlicht in:	IEEE transactions on reliability 2015-12, Vol.64 (4), p.1158-1163
Hauptverfasser:	Yang, Siyuan Frank, Chien, Wei-Ting Kary
Format:	Artikel
Sprache:	eng
Schlagworte:	design of experiments early failure Electromigration Indexes Integrated circuits linear model Optimization Reliability Response surface methodology Semiconductor device modeling Uniform design
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